Lithium niobate, as an excellent multifunctional crystal material, has been widely used in the fields of optics, acoustics, electricity and electronics. Some studies have shown that in the application of integrated optoelectronic devices, lithium niobate wafer bonding can increase the transmission frequency of the device, reduce losses, and achieve high integration density. This paper summarizes the research status of lithium niobate wafer bonding technology at home and abroad in recent years, introduces the analysis methods of bonding strength, and the latest progress of lithium niobate bonded wafers in integrated optoelectronic devices, and looks forward to the future development of lithium niobate bonding technology.