Chinese Journal of Lasers, Volume. 52, Issue 4, 0402401(2025)
High‐Throughput Helical Drilling of Shaped Micro‐Hole Arrays with Multi‐Beam Ultrafast Laser
Fig. 2. Effect of focal position on hole shape during stepwise adjustment of drilling parameters
Fig. 3. Machining results based on drilling parameter two-stage adjustment process of "first lower penetrating hole and then upper expanding hole"
Fig. 4. Effects of change range and rate of drilling parameters on hole shape (L is -6‒6 mm)
Fig. 5. Simulation of multi-beam helical drilling. (a) Optical path simulation model; (b) spot paths and rotation radii of sub-beams near focal plane; (c) influence of angle of beam incident of Dove prism on focused sub-beam angle during helical drilling process; (d)‒(f) focused sub-beam angle changes during helical drilling process under different beam splitting modes
Fig. 6. Parallel processing process of 9 beams (3×3) captured by coaxial imaging system
Fig. 7. Uniformity of micro-holes drilled by multi-beam helical parallel processing system
Fig. 8. Coaxial images and SEM images of multi-beam helical drilling process under different beam-splitting modes. (a)(b) 1×9;
Fig. 9. Multi-beam processing of shaped micro-holes based on dynamic regulation of optical rotation parameters. (a) Coaxial images at different moments and final micro-hole cross-section during 16-beam (4×4) helical parallel processing ; (b) schematic of dynamic change of beam-rotation angle; (c) cross section of shaped micro-holes drilled by multi-beam helical processing system
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Zhanwen A, Penghui Zhang, Yao Lu, Kaihu Fu, Nan Zhao, Guisheng Zou. High‐Throughput Helical Drilling of Shaped Micro‐Hole Arrays with Multi‐Beam Ultrafast Laser[J]. Chinese Journal of Lasers, 2025, 52(4): 0402401
Category: Laser Micro-Nano Manufacturing
Received: Jul. 22, 2024
Accepted: Aug. 21, 2024
Published Online: Jan. 20, 2025
The Author Email: Zou Guisheng (zougsh@tsinghua.edu.cn)
CSTR:32183.14.CJL241076