[1] [1] Kim L, Choi J, Jang S, et al.. Thermal Analysis of Multichip LED Packages[M]. SPIE, 2006, 6355: 63550E.

[2] [2] Narendran N, Gu Y. Life of LED-based white light sources[J]. Journal of Display Technology, 2005, 1(1): 167-171.

[3] [3] Xiaoyun F, Xiaojian L, Yan W. Research and analysis of the design development and perspective technology for LED lighting products[C]. Computer-Aided Industrial Design & Conceptual Design, IEEE, 2009. 1330-1334.

[4] [4] Tang Kun, Zhuo Ningze, Shi Fenghua et al.. Research status and development trends of LED packaging[J]. China Illuminating Engineering Journal, 2014, 25(1): 26-30.

[5] [5] Fang Jun, Hua Gang, Fu Renli, et al.. Structure and substrate for high power white LED package[J]. Semiconductor Technology, 2013, 38(2): 140-147.

[6] [6] Arik M, Becker C A, Weaver S E, et al.. Thermal management of LEDs: package to system[J]. Optical Science and Technology, SPIE, 2004, 5187: 64-75.

[7] [7] Wan Z, Liu J, Su K, et al.. Flow and heat transfer in porous micro heat sink for thermal management of high power LEDs[J]. Microelectronics Journal, 2011, 42(5): 632-637.

[8] [8] Swiatczak T, Olbrycht R, Apolinarzak J, et al.. Pulse thermography measurements of heat dissipation from high power LED[C]. Mixed Design of Integrated Circuits & Systems, 2009 MIXDES'09 MIXDES- 16th International Conference. IEEE. 2009. 375-377.

[9] [9] Su Da. A Study on Thermal Performance of Packaging of Hing-Power LEDs[D]. Zhejiang: Zhejiang University, 2008.

[10] [10] Chen Mingxiang. Advances in low thermal resistance packaging for high-power LEDs[J]. Semiconductor Photoelectric, 2011, 32(5): 599-605.

[11] [11] Gwinn J P, Webb R. Performance and testing of thermal interface materials[J]. Microelectronics Journal, 2003, 34(3): 215-222.

[12] [12] Hu X, Jiang L, Goodson K E. Thermal characterization of eutectic alloy thermal interface materials with void- like inclusions[C]. Semiconductor Thermal Measurement and Management Symposium, 2004 Twentieth Annual IEEE, 2004. 98-103.

[13] [13] Feng Xiu, Gu Boqin. Leakage rate calculation of matallic gasket connections[J]. CIESC Journal, 2010, (5): 1208-1212.