[1] [1] TAKAI T, IWAMOTO H, TAKAMINE Y, et al. High-performance SAW resonator on new multilayered substrate using LiTaO3 crystal［J］. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2017: 1382-1389.

[2] [2] BUTAUD E, BALLANDRAS S, BOUSQUET M, et al. Innovative smart cutTM piezo on insulator (POI) substrates for 5G acoustic filters［C］∥San Francisco, CA, USA:2020 IEEE International Electron Devices Meeting (IEDM), 2020.

[3] [3] TAKAI T, IWAMOTO H, TAKAMINE Y, et al. High-performance SAW resonator with simplified LiTaO3/SiO2 double layer structure on Si substrate［J］. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2019: 1006-1013.

[4] [4] XU H, FU S, SU R, et al. SAW filters on LiNbO3/SiC heterostructure for 5G n77 and n78 band applications［J］. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2023: 1157-1169.

[5] [5] ZHOU H, ZHANG S, LI Z, et al. Surface wave and Lamb wave acoustic devices on heterogenous substrate for 5G front-ends［C］∥San Francisco, CA, USA:2020 IEEE International Electron Devices Meeting (IEDM), 2020.

[6] [6] KIMURA T, OMURA M, KISHIMOTO Y, et al. Comparative study of acoustic wave devices using thin piezoelectric plates in the 3-5 GHz range［J］. IEEE Transactions on Microwave Theory and Techniques, 2019: 915-921.

[7] [7] WU J, ZHANG S, ZHANG L, et al. Exploring low-loss surface acoustic wave devices on heterogeneous substrates［J］. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2022: 2579-2584.

[8] [8] WARDER P, LINK A. Golden age for filter design: Innovative and proven approaches for acoustic filter, duplexer, and multiplexer design［J］. IEEE Microwave Magazine, 2015: 60-72.

[9] [9] BALYSHEVA O L. SAW filters for mobile communications: Achievements and prospects［C］∥Saint-Petersburg, Russia:2019 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF), 2019.

[10] [10] LI Q, FU S, WANG R, et al. Enhanced power durability of surface acoustic wave filter with Al/Ti/Cu/Ti electrodes［J］. Journal of Alloys and Compounds, 2018: 222-228.

[11] [11] HAGELAUER A, FATTINGER G, RUPPEL C C W, et al. Microwave acoustic wave devices: Recent advances on architectures, modeling, materials, and packaging［J］. IEEE Transactions on Microwave Theory and Techniques, 2018: 4548-4562.

[12] [12] ZHANG Y M, JIN J, LI H L, et al. A novel method to extract COM parameters for SAW based on FEM［C］∥Harbin, China:2019 13th Symposium on Piezoelectrcity, Acoustic Waves and Device Applications (SPAWDA), 2019.