Fig. 1. Thermal cycle test results^[8]. (a) Output power of continuous wave pump diode after 8 cycles at 2 ℃/min and 50 cycles at 5 ℃/min; (b) microchip laser average output power for same number of cycles at two different temperature settings

Fig. 2. Comparison of packaging for different lasers^[9]. (a) Bonding packaging lasers; (b) welding packaging lasers; (c) example of power instabilities encountered after thermal cycles on adhesive assembled lasers and appeared competitive peaks after adhesive-based devices thermal cycles

Fig. 3. Stress and strain distribution of materials at different interconnect interfaces after thermal shock^［11]

Fig. 4. Stress and strain of the"most dangerous element"of the three interconnect interfaces evolve with time^[11]. (a) Stress; (b) strain

Fig. 5. Variation of maximum electro-optical conversion efficiency of two structures with temperature^[12]

Fig. 6. FOB response caused by the introduction of single-mode fiber and the application of 5 Hz vibration by electromagnetic exciter in FOB [inset: enlarged view of the signals when the shaker was on (left) and off (right)]^[19]

Fig. 7. Change in laser power and photodiode current under different dose rates of irradiation^[27]. (a) Laser power; (b) photodiode current

Fig. 8. Narrow linewidth ECSL based on permanent refractive index modulated Bragg grating feedback^[28]. (a) Schematic of the ECSL device for radiation resistance; (b) simple model of the laser structure; (c) photograph of the laser

Fig. 9. Schematic diagram of space radiation effect performance damage process^[30]