Photonics Research, Volume. 9, Issue 7, 1255(2021)

PIC-integrable, uniformly tensile-strained Ge-on-insulator photodiodes enabled by recessed SiNx stressor

Yiding Lin1,2,5, Danhao Ma3, Kwang Hong Lee2, Rui-Tao Wen4,6, Govindo Syaranamual2, Lionel C. Kimerling3, Chuan Seng Tan1,2、*, and Jurgen Michel2,3,4,7
Author Affiliations
  • 1School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Singapore
  • 2Low Energy Electronic Systems (LEES), Singapore-MIT Alliance for Research and Technology, Singapore 138602, Singapore
  • 3Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
  • 4Materials Research Laboratories, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
  • 5Current address: Max Planck Institute of Microstructure Physics, Halle (Saale) 06120, Germany
  • 6Current address: Southern University of Science and Technology, Shenzhen 518055, China
  • 7e-mail: jmichel@mit.edu
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    Yiding Lin, Danhao Ma, Kwang Hong Lee, Rui-Tao Wen, Govindo Syaranamual, Lionel C. Kimerling, Chuan Seng Tan, Jurgen Michel, "PIC-integrable, uniformly tensile-strained Ge-on-insulator photodiodes enabled by recessed SiNx stressor," Photonics Res. 9, 1255 (2021)

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    Paper Information

    Category: Silicon Photonics

    Received: Jan. 15, 2021

    Accepted: Apr. 26, 2021

    Published Online: Jun. 21, 2021

    The Author Email: Chuan Seng Tan (tancs@ntu.edu.sg)

    DOI:10.1364/PRJ.419776

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