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Semiconductor Optoelectronics, Volume. 46, Issue 2, 327(2025)

Simulation Analysis of SiP Bonding Wires in FOG Signal Processing Circuits

WANG Jiaqiang1, QIU Haitao1, HE Yang2, and SHI Haiyang2
Author Affiliations
  • 1Beijing Key Laboratory of High Dynamic Navigation Technology, Beijing Information Science & Technology University, Beijing 100101, CHN
  • 2Beijing Aerospace Times Optical-Electronic Technology Co., Ltd., Beijing 100094, CHN
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    WANG Jiaqiang, QIU Haitao, HE Yang, SHI Haiyang. Simulation Analysis of SiP Bonding Wires in FOG Signal Processing Circuits[J]. Semiconductor Optoelectronics, 2025, 46(2): 327

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    Received: Mar. 11, 2025

    Accepted: Sep. 18, 2025

    Published Online: Sep. 18, 2025

    The Author Email:

    DOI:10.16818/j.issn1001-5868.20250311001

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology