Semiconductor Optoelectronics, Volume. 46, Issue 2, 327(2025)
Simulation Analysis of SiP Bonding Wires in FOG Signal Processing Circuits
The development of high-precision fiber optic gyroscope (FOG) shows a distinct trend toward system integration and structural miniaturization. The primary objective is to achieve device miniaturization through structural optimization while maintaining high measurement accuracy. In this study, the ADC, FPGA, and DAC dies of a FOG signal processing circuit were integrated onto a single substrate using gold wire bonding technology within a system-in-package (SiP) framework. To address the substantial impact of the physical parameters of gold bonding wires (e.g., wire diameter, span, and arc height) on signal integrity, a high-fidelity electromagnetic simulation model was developed to systematically investigate the coupling effects between the geometric parameters of gold bonding wires and the width of substrate microstrip lines on signal transmission performance. An L9(34) orthogonal experimental design was employed to conduct multi-objective optimization across four groups of critical parameter combinations, yielding an optimal configuration of SiP bonding wires and substrate microstrip lines tailored for FOG signal processing circuits. These findings provide practical guidance for SiP integration in FOG signal processing circuits and valuable insights for engineering applications.
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WANG Jiaqiang, QIU Haitao, HE Yang, SHI Haiyang. Simulation Analysis of SiP Bonding Wires in FOG Signal Processing Circuits[J]. Semiconductor Optoelectronics, 2025, 46(2): 327
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Received: Mar. 11, 2025
Accepted: Sep. 18, 2025
Published Online: Sep. 18, 2025
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