Semiconductor Optoelectronics, Volume. 46, Issue 2, 327(2025)

Simulation Analysis of SiP Bonding Wires in FOG Signal Processing Circuits

WANG Jiaqiang1, QIU Haitao1, HE Yang2, and SHI Haiyang2
Author Affiliations
  • 1Beijing Key Laboratory of High Dynamic Navigation Technology, Beijing Information Science & Technology University, Beijing 100101, CHN
  • 2Beijing Aerospace Times Optical-Electronic Technology Co., Ltd., Beijing 100094, CHN
  • show less

    The development of high-precision fiber optic gyroscope (FOG) shows a distinct trend toward system integration and structural miniaturization. The primary objective is to achieve device miniaturization through structural optimization while maintaining high measurement accuracy. In this study, the ADC, FPGA, and DAC dies of a FOG signal processing circuit were integrated onto a single substrate using gold wire bonding technology within a system-in-package (SiP) framework. To address the substantial impact of the physical parameters of gold bonding wires (e.g., wire diameter, span, and arc height) on signal integrity, a high-fidelity electromagnetic simulation model was developed to systematically investigate the coupling effects between the geometric parameters of gold bonding wires and the width of substrate microstrip lines on signal transmission performance. An L9(34) orthogonal experimental design was employed to conduct multi-objective optimization across four groups of critical parameter combinations, yielding an optimal configuration of SiP bonding wires and substrate microstrip lines tailored for FOG signal processing circuits. These findings provide practical guidance for SiP integration in FOG signal processing circuits and valuable insights for engineering applications.

    Tools

    Get Citation

    Copy Citation Text

    WANG Jiaqiang, QIU Haitao, HE Yang, SHI Haiyang. Simulation Analysis of SiP Bonding Wires in FOG Signal Processing Circuits[J]. Semiconductor Optoelectronics, 2025, 46(2): 327

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category:

    Received: Mar. 11, 2025

    Accepted: Sep. 18, 2025

    Published Online: Sep. 18, 2025

    The Author Email:

    DOI:10.16818/j.issn1001-5868.20250311001

    Topics