Hybrid-integrated 200 Gb/s REC-DML array transmitter based on photonic wire bonding technology

Yuxin Ma; Jie Zhao; Tongtong Yang; Yipeng Mei; Zhenxing Sun; Jun Lu; Shaobo Li; Xiang Ma; Xiangfei Chen

doi:10.3788/COL202422.081401

Chinese Optics Letters, Volume. 22, Issue 8, 081401(2024)

Hybrid-integrated 200 Gb/s REC-DML array transmitter based on photonic wire bonding technology

Yuxin Ma¹, Jie Zhao¹, Tongtong Yang¹, Yipeng Mei¹, Zhenxing Sun^1、*, Jun Lu^1、**, Shaobo Li², Xiang Ma², and Xiangfei Chen¹

Author Affiliations

¹Key Laboratory of Intelligent Optical Sensing and Manipulation of the Ministry of Education & National Laboratory of Solid State Microstructures & College of Engineering and Applied Sciences & Institute of Optical Communication Engineering & Nanjing University-Tongding Joint Lab for Large-Scale Photonic Integrated Circuits, Nanjing University, Nanjing 210023, China

²Optical Communication Research and Development Center, 54th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang 050081, China

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References(24)

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Yuxin Ma, Jie Zhao, Tongtong Yang, Yipeng Mei, Zhenxing Sun, Jun Lu, Shaobo Li, Xiang Ma, Xiangfei Chen, "Hybrid-integrated 200 Gb/s REC-DML array transmitter based on photonic wire bonding technology," Chin. Opt. Lett. 22, 081401 (2024)

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