Optoelectronic Technology, Volume. 42, Issue 2, 107(2022)
Optimization of Anti‑vibration Design for PCB of Airborne Electronic Equipment
Figures & Tables(11)
Fig. 2. The amplitude-frequency characteristic curves of the system transmissibility
Fig. 3. The PCB finite element meshing model of original design scheme
Fig. 4. The PCB maximum displacement and stress distribution diagrams of original design scheme
Fig. 5. The composition and dimensions of the rubber shock absorber
Fig. 6. The vibration response spectrum of the main chip and the motherboard of the original design square
Fig. 7. The vibration response spectrum of the main chip and the motherboard of the scheme 1
Fig. 8. The vibration response spectrum of the main chip and the motherboard of the scheme 2
Fig. 9. The vibration response spectrum of the main chip and the motherboard of the scheme 3
Table 1. Mechanical performance parameters of various materials
View tableView in ArticleTable 1. Mechanical performance parameters of various materials
密度/（kg·m-3） 弹性模量/GPa 泊松比 母板及核心板 950 1.2 0.42 主芯片 1 040 1.07 0.410 1 支撑柱 2 700 71 0.33
Table 2. Comparison of the experimental results between the optimized schemes and the original design scheme
View tableView in ArticleTable 2. Comparison of the experimental results between the optimized schemes and the original design scheme
原设计方案 优化方案一 优化方案二 优化方案三 主芯片加速度均方根值/g 15.658 12.083 10.428 8.537 母板加速度均方根值/g 14.950 14.130 8.828 8.912
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Guangming TANG, Yajun SHAN, Libang SHU, Chen SHENG. Optimization of Anti‑vibration Design for PCB of Airborne Electronic Equipment[J]. Optoelectronic Technology, 2022, 42(2): 107
Paper Information
Category: Research and Trial-manufacture
Received: Oct. 24, 2021
Accepted: --
Published Online: Jul. 29, 2022
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