Fig. 1. Definitions of wafers TTV, Warp and Bow

Fig. 2. Schematic diagram of measurement principle of double-sided polished wafer

Fig. 3. Cross-sections of measurement cavity using Fizeau interferometer

Fig. 4. Schematic diagram of mapping error analysis

Fig. 5. Pixel coordinates of three points in different CCDs

Fig. 6. Experimental setup diagram

Fig. 7. Pixel coordinates of three points in different intensity diagrams

Fig. 8. Topography of the front and back of the measured wafer and cavity topography

Fig. 9. Wafer thickness variation and morphology of surface shape deviation from the central plane of the wafer

Fig. 10. Flip measurement experimental setup diagram

Fig. 11. Wafer thickness variation and morphology of surface shape deviation from the central plane obtained by the flip method