Fig. 1. (a) Schematic of vertical-chip structure; (b) schematic of flip-chip structure; (c) surface of vertical-chip;(d) surface of flip-chip; (e) optical power curves for vertical-chip and flip-chip

Fig. 2. Equivalent circuit diagram of micro LED array

Fig. 3. 6×6 flip-chip AlGaInP LED array device

Fig. 4. (a) Schematic of test system; (b) experimental test system

Fig. 5. Theoretical calculation and test results of output power. (a) m=1, ambient temperature of 30 ℃;(b) m=1, ambient temperature of 60 ℃; (c) m=6, ambient temperature of 30 ℃;(d) m=6, ambient temperature of 60 ℃

Fig. 6. Variation of output power of LED array with injection current

Fig. 7. Temperature distributions of basement structure. (a) PDMS rectangular basement structure;(b) Cu rectangular basement structure; (c) PDMS perforated rectangular basement structure;(d) Cu perforated rectangular basement structure; (e) PDMS column array basement structure;(f) Cu column array basement structure

Fig. 8. (a) Relationship between thermal resistance of PDMS and air convection coefficient for different structures;(b) relationship between thermal resistance of Cu and air convection coefficient for different structures