Advances in Radio Frequency Integration Applications of Through Glass Via Technology

YU Tian; CHEN Xin; LIN Jingyu; ZHONG Yi; LIANG Junge; GU Xiaofeng; YU Daquan

doi:10.16257/j.cnki.1681-1070.2025.0128

Electronics and Packaging, Volume. 25, Issue 7, 70101(2025)

Advances in Radio Frequency Integration Applications of Through Glass Via Technology

YU Tian¹, CHEN Xin², LIN Jingyu², ZHONG Yi², LIANG Junge¹, GU Xiaofeng¹, and YU Daquan^2,3、*

Author Affiliations

¹School of Integrated Circuits, Jiangnan University, Wuxi 214401, China

²School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China

³Xiamen Sky Semiconductor Technology Co., Ltd., Xiamen 361013, China

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YU Tian, CHEN Xin, LIN Jingyu, ZHONG Yi, LIANG Junge, GU Xiaofeng, YU Daquan. Advances in Radio Frequency Integration Applications of Through Glass Via Technology[J]. Electronics and Packaging, 2025, 25(7): 70101

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Paper Information

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Received: Mar. 2, 2025

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: YU Daquan (yudaquan@xmu.edu.cn)

DOI:10.16257/j.cnki.1681-1070.2025.0128

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