With the development of radio frequency (RF) systems towards high frequency and integration, through glass via (TGV) technology has become a core solution to break through the limitations of traditional substrates due to the low dielectric loss and high thermal conductivity of glass substrates. The manufacturing process, RF device integration innovation, and application progress of TGV technology in 5G/6G communication and millimeter wave systems are systematically reviewed. In the field of RF devices, TGV significantly improves the performance density of passive devices such as lumped inductors and capacitors through three-dimensional interconnection, and supports filter design to achieve low insertion loss and miniaturization. In antenna applications, TGV multi-layer stacking technology promotes the expansion of packaged antennas to the millimeter wave frequency band, while improving interconnection density and achieving RF heterogeneous integration through ultra-thin adapter boards and embedded fan out technology. The future development trends include innovations in high aspect ratio through-hole technology, improvement in high-frequency process consistency, and multi physics field collaborative design to break through the performance bottleneck of millimeter wave frequency band, accelerate the large-scale application of TGV in 5G/6G communications, terahertz systems, and intelligent terminals, and provide high-performance and low-cost solutions for RF integration and heterogeneous packaging.