Chinese Optics Letters, Volume. 12, Issue s2, S22201(2014)
Study on the material-remove mechanism of SiC surface polishing
As aerospace technology develops rapidly, higher demand for aerospace optic system is brought forward. With its excellent physical qualities, SiC becomes a very promising material for speculums. The material-remove mechanism of SiC surface polishing is studied, that is, the grinding mechanism of ceramic material. Indentation fracture model is also introduced and is used to explain material-remove mechanism of SiC surface polishing, and the model of SiC polishing in ideal condition is analyzed. Finally, the material-remove mechanism of SiC polishing in real state is studied.
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Fan Di, "Study on the material-remove mechanism of SiC surface polishing," Chin. Opt. Lett. 12, S22201 (2014)
Category: Optical Design and Fabrication
Received: Dec. 7, 2013
Accepted: Mar. 15, 2014
Published Online: Nov. 12, 2014
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