Chinese Optics Letters, Volume. 12, Issue s2, S22201(2014)

Study on the material-remove mechanism of SiC surface polishing

Fan Di1,2
Author Affiliations
  • 1Key Laboratory of Optical System Advanced Manufacturing Technology, Chinese Academy of Sciences, Changchun 130033, China
  • 2Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China
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    As aerospace technology develops rapidly, higher demand for aerospace optic system is brought forward. With its excellent physical qualities, SiC becomes a very promising material for speculums. The material-remove mechanism of SiC surface polishing is studied, that is, the grinding mechanism of ceramic material. Indentation fracture model is also introduced and is used to explain material-remove mechanism of SiC surface polishing, and the model of SiC polishing in ideal condition is analyzed. Finally, the material-remove mechanism of SiC polishing in real state is studied.

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    Fan Di, "Study on the material-remove mechanism of SiC surface polishing," Chin. Opt. Lett. 12, S22201 (2014)

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    Paper Information

    Category: Optical Design and Fabrication

    Received: Dec. 7, 2013

    Accepted: Mar. 15, 2014

    Published Online: Nov. 12, 2014

    The Author Email:

    DOI:10.3788/col201412.s22201

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