Optimization of ultrasonic-assisted underwater laser cutting monocrystalline silicon process based on CBDC

ZHOU Jia; ZHOU Liao; OUYANG Li; JIAO Hui; HUANG Yuxing; LONG Yuhong

doi:10.7510/jgjs.issn.1001-3806.2024.06.018

Laser Technology, Volume. 48, Issue 6, 913(2024)

Optimization of ultrasonic-assisted underwater laser cutting monocrystalline silicon process based on CBDC

ZHOU Jia^1,2, ZHOU Liao¹, OUYANG Li¹, JIAO Hui¹, HUANG Yuxing¹, and LONG Yuhong^1、*

¹Guangxi Key Laboratory of Manufacturing Systems and Advanced Manufacturing Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

²School of Electronic Engineering and Automation, Guilin University of Electronic Technology, Guilin 541004, China

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ZHOU Jia, ZHOU Liao, OUYANG Li, JIAO Hui, HUANG Yuxing, LONG Yuhong. Optimization of ultrasonic-assisted underwater laser cutting monocrystalline silicon process based on CBDC[J]. Laser Technology, 2024, 48(6): 913

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Paper Information

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Received: Oct. 30, 2023

Accepted: Feb. 13, 2025

Published Online: Feb. 13, 2025

The Author Email: LONG Yuhong (longyuhong@guet.edu.cn)

DOI:10.7510/jgjs.issn.1001-3806.2024.06.018

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology