Laser Technology, Volume. 48, Issue 6, 913(2024)

Optimization of ultrasonic-assisted underwater laser cutting monocrystalline silicon process based on CBDC

ZHOU Jia1,2, ZHOU Liao1, OUYANG Li1, JIAO Hui1, HUANG Yuxing1, and LONG Yuhong1、*
Author Affiliations
  • 1Guangxi Key Laboratory of Manufacturing Systems and Advanced Manufacturing Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
  • 2School of Electronic Engineering and Automation, Guilin University of Electronic Technology, Guilin 541004, China
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    In order to rapidly optimize the ultrasonic-assisted underwater nanosecond laser cutting process, the impact of cavitation bubble dynamics characteristics (CBDC) on the process outcomes was analyzed. And theoretical analysis and experimental validation were carried out using numerical simulation analysis, orthogonal experiments, and high-speed imaging methods. Optimal parameters for the ultrasonic-assisted underwater laser cutting process were obtained, and the CBDC was confirmed to be the primary factor affecting the cutting process. The results showe that as the interference of cavitation bubbles with the laser beam increases, the cutting depth decreases while the cutting speed increases. As the depth-to-width ratio of the groove increases, the pulsating shock from cavitation bubbles exerte greater equivalent stress on the groove bottom. The maximum depth-to-width ratio of approximately is 1.71 achieved when ultrasonic power Pu=65 W, water layer thickness hw=1 mm, laser pulse frequency fq=20 kHz, and laser scanning speed v=1 mm/s, respectively. Under these conditions, the groove width is approximately 99.88 μm, the groove depth is approximately 170.18 μm, the size of the heat-affected zone is approximately 31.71 μm, and the microcrack length is approximately 33.42 μm. At this time, the cavitation bubble cycle is shorter (approximately 100 μs~160 μs). This research can provide valuable insights for optimizing the parameters of multi-field underwater laser composite processing.

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    ZHOU Jia, ZHOU Liao, OUYANG Li, JIAO Hui, HUANG Yuxing, LONG Yuhong. Optimization of ultrasonic-assisted underwater laser cutting monocrystalline silicon process based on CBDC[J]. Laser Technology, 2024, 48(6): 913

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    Paper Information

    Category:

    Received: Oct. 30, 2023

    Accepted: Feb. 13, 2025

    Published Online: Feb. 13, 2025

    The Author Email: LONG Yuhong (longyuhong@guet.edu.cn)

    DOI:10.7510/jgjs.issn.1001-3806.2024.06.018

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