Advanced Photonics, Volume. 7, Issue 6, 064001(2025)

Erbium-doped/erbium-ytterbium co-doped waveguide amplifiers in silicon-based optoelectronics: recent progress

Xiwen He, Zheng Zhang, Deyue Ma, Chen Zhou, Huihuang Hou, Youqiang Shuai, Jiqiao Liu, Rongping Wang*, Zhiping Zhou*, and Weibiao Chen*
Figures & Tables(20)
Research field overview of EDWAs/EYCDWAs, which can be roughly classified into three parts: host materials, novel structures, and application scenarios. Among them, based on the properties of materials, host materials are further divided into two parts: inorganic and organic waveguide amplifiers. Some schematic sources: Er:Si3N4, reprinted from Ref. 18; Er:TeO2, reprinted from Ref. 75; Er:Al2O3, reprinted from Ref. 21; Er:Ta2O5, reprinted from Ref. 66; Er:polymer, reprinted from Ref. 92; Er:TFLN, reprinted from Ref. 35; Er:silicate, reprinted from Ref. 110; LMA, reprinted from Ref. 22; ULLW, reprinted from Ref. 93; slot, reprinted from Ref. 19; double-layer, reprinted from Ref. 57; optical communication, reprinted from Ref. 127; optoelectronic computing, reprinted from Ref. 128; quantum computing, reprinted from Ref. 129; and LiDAR, reprinted from Ref. 121.
Er:Si3N4 waveguide amplifiers fabricated by the damascene process, reprinted from Ref. 18.
Er/Er−Yb:TFLN waveguide amplifiers fabricated by the PLACE process. (a) Er:TFLN waveguide amplifiers, reprinted from Ref. 23. (b) Four-channel Er:TFLN waveguide amplifier array, reprinted from Ref. 35. (c) Er−Yb:TFLN waveguide amplifiers, reprinted from Ref. 25. (d) Coherent beam combination of Er:TFLN waveguide amplifiers, reprinted from Ref. 34.
Er/Er−Yb:TFLN waveguide amplifiers fabricated by EBL and RIE process. (a)–(c) Er:TFLN waveguide amplifiers, reprinted from Refs. 31, 36, and 40. (d) Er−Yb:TFLN waveguide amplifiers, reprinted from Ref. 24.
Er/Er‐Yb:Al2O3 waveguide amplifiers fabricated by directly etching the gain medium. (a), (b) Er:Al2O3 waveguide amplifiers, reprinted from Refs. 48 and 58. (c) Er‐Yb:Al2O3 waveguide amplifiers, reprinted from Ref. 49.
Er/Er‐Yb:Al2O3 waveguide amplifiers fabricated by avoiding direct etching of the gain medium. (a) Si‐Er:Al2O3 waveguide amplifiers, reprinted from Ref. 20. (b) Si3N4‐Er:Al2O3 waveguide amplifiers, reprinted from Ref. 21. (c) HSQ‐Er:Al2O3 waveguide amplifiers, reprinted from Ref. 62. (d) GeSbS‐Er:Al2O3 waveguide amplifiers, reprinted from Ref. 50.
Er:TeO2 waveguide amplifiers fabricated by (a) directly etching the gain medium, reprinted from Ref. 79, and (b) avoiding direct etching of the gain medium, reprinted from Ref. 75.
Er:Ta2O5 waveguide amplifiers fabricated by (a) directly etching the gain medium, reprinted from Ref. 68, and (b) avoiding direct etching of the gain medium, reprinted from Ref. 66.
Er:silicate waveguide amplifiers. (a) Si3N4 hybrid, strip-loaded, and slot Er-Yb:silicate waveguide amplifiers, reprinted from Refs. 110112" target="_self" style="display: inline;">–112. (b) Single-crystalline erbium chlorosilicate compound nanowire, reprinted from Ref. 113.
Er/Er-Yb:polymer waveguide amplifiers with embedded structure. (a) SU-8-loaded waveguide amplifier, reprinted from Ref. 88. (b) Inverted ridge waveguide amplifier, reprinted from Ref. 114.
Waveguide amplifiers with Er:polymer up-cladding. (a) Without aluminum mirror, reprinted from Ref. 84. (b) With aluminum mirror, reprinted from Ref. 92.
Low-confinement Er:Si3N4 waveguide amplifiers. (a) Multi-lane Er:Si3N4 waveguide amplifiers, reprinted from Ref. 27. (b) and (c) Tunable laser based on Er:Si3N4 waveguide amplifiers, reprinted from Refs. 12, 115, and 26.
Large mode area Er:TFLN waveguide amplifier, reprinted from Ref. 22.
Er:Al2O3 slot waveguide amplifier, reprinted from Ref. 19.
Main preparation processes of Er-doped/Er-Yb co-doped gain media. (a) Ion implantation, reprinted from Ref. 116. (b) ALD, reprinted from Ref. 19. (c) Magnetron sputtering, reprinted from Ref. 49. (d) Ion slicing combined with bonding process, reprinted from Ref. 44.
Main preparation processes of Er-doped/Er-Yb co-doped waveguide. (a) Damascene process, reprinted from Ref. 117. (b) EBL combined with ICP-RIE, reprinted from Ref. 118. (c) PLACE, reprinted from Ref. 119.
Typical application scenarios of EDWAs/EYCDWAs. (a) Coherent optical transmission, reprinted from Ref. 29. (b) On-chip integrated lasers, reprinted from Refs. 12, 17, and 13. (c) LiDAR, reprinted from Refs. 121 and 122.
Commercial applications of EDWAs/EYCDWAs. (a) Teem Photonics’ Metro module, reprinted from Ref. 101. (b) Inplane Photonics’ LBIC module, reprinted from Ref. 103. (c) Packaged EDWL, reprinted from Refs. 12 and 18. (d) Packaged EDWA, reprinted from Ref. 107.
Schematic diagram of SBO chips with EDWAs/EYCDWAs and their typical application scenarios.
  • Table 1. Comparison for representative Er-doped/Er-Yb co-doped waveguide amplifiers.

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    Table 1. Comparison for representative Er-doped/Er-Yb co-doped waveguide amplifiers.

    GMWSFPMFPWL (cm)G (dB)UNG (dB/cm)Loss (dB/cm)Ref.
    Er:Si3N4ChannelI/I-2 MeVD50.030.00.60.0518
    Er:Si3N4StripI/I-500 keVD17.015.00.880.050.127
    Er/Yb:TFLNRidgeC + SE + I0.58.2616.521.0824
    Er/Yb:TFLNRidgeC + SPLACE15.027.01.80.3625
    Er:TFLNLMAC + SPLACE7.028.04.022
    Er:TFLNRidgeC + SPLACE10.020.02.00.7246
    Er:TFLNRidgeC + SPLACE3.618.05.00.1623
    Er:TFLNRidgeC + SPLACE2.513.05.234
    Er:TFLNStripC + SE + I9.1638.04.150.432
    Er:TFLNRidgeC + SE + I1022.262.20.1831
    Er:TFLNRidgeC + SE + I2.58166.24.237
    Er:TFLNRidgeC + SE + I2.824.88.8638
    Er:TFLNRidgeC + SL + I5.618.83.360.633
    Er:TFLNRibC + SE + R0.55.210.4230
    Er:TFLNRibC + SE + R0.538.315.666.836
    Er:TFLNRidgeC + SE + I0.515300.8339
    Er/Yb:Al2O3RidgeSputteringL + W3.04.31.430.249
    Er:Al2O3SlotALDE + D250  μm20.1 ± 7.3135.83 ± 4.1819
    Er:Al2O3Double-layerSputteringL + R10.018.1 ± 0.91.81 ± 0.090.65 ± 0.0521
    Er:Al2O3ChannelSputteringL + R12.920.01.550.1948
    Er:Al2O3RidgeSputteringE + R12.933.52.60.4658
    Er:Al2O3Strip-loadedALDE + P4.66.27 ± 0.620.250
    Er:Al2O3Strip-loadedALDEBL3.558.42.376.262
    Er:Al2O3Strip-loadedALDEBL1.04.6 ± 0.45.0 ± 0.461
    Er:Al2O3Strip-loadedALDEBL9.3114.41.58.560
    Er:Al2O3RidgePEALDL + W0.22.74 ± 0.413.71 ± 1.970.6 ± 0.1556
    Er:TeO2RidgeSputteringCoated2.23.81.730.2575
    Er:TeO2RidgeSputteringCoated6.75.00.750.2575
    Er:TeO2BilayerSputteringL + R5.014.02.80.679
    Er:Ta2O5Double-layerSputteringL + I1.26.364.630.6766
    Er:Ta2O5RibSputteringL + IBM2.34.83 ± 0.112.10.6568
    Er:Ta2O5RidgeSputteringL + L2.03.1 ± 0.11.174
    Er:silicateNanowire56.2  μm122.0113
    Er/Yb:silicateRibSputteringCoated0.593.15.253.2 ± 0.3110
    Er/Yb:silicateSlotSputteringL + D0.61.72.8314.7112
    Er/Yb:silicateStrip-loadedSputteringL + D0.785.57.058.1111
    Er:polymerChannelSynthesisL + P1.06.71.881
    Er:polymerChannelSynthesisL + P1.07.44.292
    Er/Yb:polymerChannelSynthesisL + P0.59.52.2187
    Er/Yb:polymerEmbeddedSynthesisL + P1.62791
    Er/Yb:polymerEmbeddedSynthesisL + P1.315.111.65.3 ± 0.3114
    Er/Yb:polymerStrip-loadedSynthesisL + P0.517.71.888
    Er/Yb:polymerChannelSynthesisDD1.26.62.9130
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Xiwen He, Zheng Zhang, Deyue Ma, Chen Zhou, Huihuang Hou, Youqiang Shuai, Jiqiao Liu, Rongping Wang, Zhiping Zhou, Weibiao Chen, "Erbium-doped/erbium-ytterbium co-doped waveguide amplifiers in silicon-based optoelectronics: recent progress," Adv. Photon. 7, 064001 (2025)

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Paper Information

Category: Reviews

Received: Apr. 8, 2025

Accepted: Aug. 27, 2025

Published Online: Sep. 25, 2025

The Author Email: Rongping Wang (wangrongping@nbu.edu.cn), Zhiping Zhou (zjzhou@pku.edu.cn), Weibiao Chen (wbchen@siom.ac.cn)

DOI:10.1117/1.AP.7.6.064001

CSTR:32187.14.1.AP.7.6.064001

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