Laser Technology, Volume. 46, Issue 4, 474(2022)
Research on the weld and pores of glass laser welding based on response surface method
[1] [1] HUANG M H, ZHANG Q M, L Q T, et al. UV-laser welding process of copper-plated glass[J]. Chinese Journal of Lasers, 2020, 47(10): 1002007(in Chinese).
[2] [2] PANG J W, WANG Ch, CAI Y K. Research progress of laser processing technology for glass materials[J]. Laser Technology, 2021, 45(4):417-428(in Chinese).
[3] [3] FERNANDO R, JOSE M, RUI C, et al. Laser assisted glass frit sealing of dye-sensitized solar cells[J]. Solar Energy Materials and Solar Cells, 2012, 96: 43-49.
[4] [4] TAO W, MA Y A, CHEN Y B. The influence of adhesive viscosity and elastic modulus on laser spot weld bonding process[J]. International Journal of Adhesion and Adhesives, 2014, 51: 111-116.
[5] [5] TIAN R, CAO F, LI Y, et al. Application of laser-assisted glass frit bonding encapsulation in all inorganic quantum dot light emitting devices[J]. Molecular Crystals and Liquid Crystals, 2018, 676(1): 59-64.
[6] [6] FU K, LI Y, YIN L Q, et al. Effect of CuO on laser absorption in glass to glass laser bonding[C]//2014 15th International Conference on Electronic Packaging Technology.New York, USA: IEEE, 2014: 484-488.
[7] [7] BEDJAOUI M, AMIRAN J, BRUN J. Ultrathin glass to ultrathin glass bonding using laser sealing approach[C]//2019 IEEE 69th Electronic Components and Technology Conference (ECTC). New York, USA: IEEE, 2019: 995-1001.
[8] [8] SEYEDALI E, JORGE M, LUISA A, et al. Low temperature herme-tic laser-assisted glass frit encapsulation of soda-lime glass substrates[J]. Optics and Lasers in Engineering, 2017, 96: 107-116.
[9] [9] WU Q, LORENZ N, CANNON K M, et al. Glass frit as a hermetic joining layer in laser based joining of miniature devices[J]. IEEE Transactions on Components and Packaging Technologies, 2010, 33(2): 470-477.
[10] [10] RUI C, ALEXANDRE J D C R, MAAIRA J F R, et al. Glass-glass laser-assisted glass frit bonding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(12):1949-1956.
[11] [11] LORENZ N, MILLAR S, DESMULLIEZ M, et al. Hermetic glass frit packaging in air and vacuum with localized laser joining[J]. Journal of Micromechanics and Microengineering, 2011, 21: 045039.
[12] [12] LOGUNOV S, MARJANOVIC S, BALAKRISHNAN J. Laser assisted frit sealing for high thermal expansion glasses[J]. Journal of Laser Micro Nanoengineering, 2012, 7(3): 326-333.
[13] [13] ZHANG J H, YIN L Q, LI Y, et al. Experimental study about the effect of frit thickness on the residual stress of glass/glass laser bonding[J]. Optical Engineering, 2017, 56(8): 083103.
[14] [14] XIAO Y Y, WANG W, WU X Y, et al. Process design based on temperature field control for reducing the thermal residual stress in glass/glass laser bonding[J]. Optics & Laser Technology, 2017, 91: 85-91.
[15] [15] MIAO H, HE Q, ZHANG Sh W, et al. Study on pores control of vacuum plate glazing by laser sealing[J]. Laser Technology, 2019, 43(1): 38-42(in Chinese).
[16] [16] LIANG E B, HU Sh S, WANG Zh J. Optimization of GTAW cladding process of Inconel 625 on carbon steel using response surface methodology[J]. Acta Welding Sinica, 2016, 37 (6): 85-88(in Chinese).
[17] [17] WANG W, XIAO Y Y, WU X Y, et al. Optimization of laser-assisted glass frit bonding process by response surface methodology[J]. Optics & Laser Technology, 2016, 77: 111-115.
[18] [18] CHEN G Y, WANG B, ZHONG P X, et al. Laser scanning welding of 2060 Al-Li alloy with filler wire[J].Transactions of the China Welding Institution, 2020, 41(4): 44-50(in Chinese).
[19] [19] FU K, LI Y, ZHANG J H. The effect of presintering temperature on laser bonding[J]. Materials Guide: Nano and New Materials, 2014, 28(2): 114-116(in Chinese).
[20] [20] CHEN G Y, HE J, ZHONG P X, et al. Study on the porosity control during laser welding of glass[J]. Laser Technology, 2021, 45(3):286-291(in Chinese).
Get Citation
Copy Citation Text
CHEN Genyu, CHENG Shaoxiang, ZHONG Peixin. Research on the weld and pores of glass laser welding based on response surface method[J]. Laser Technology, 2022, 46(4): 474
Category:
Received: Mar. 23, 2021
Accepted: --
Published Online: Aug. 2, 2022
The Author Email: CHEN Genyu (hdgychen@163.com)