Laser & Optoelectronics Progress, Volume. 62, Issue 9, 0900003(2025)

Research Progress on Laser Cutting Separation of Glass Materials

Jiangtao Ni1... Aowei Xing2, Lijuan Ma3, Dong Xie1, Peng Liu2 and Yong Xie1,* |Show fewer author(s)
Author Affiliations
  • 1Captial Aerospace Machinery Co., Ltd., Beijing 100076, China
  • 2Advanced Processing Lab, Beijing Institute of Technology, Beijing 100081, China
  • 3The Third Military Representative Office of Rocket Force Equipment Department in Beijing Area, Beijing 100076, China
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    Figures & Tables(16)
    Ultra-precision machining experimental system and confocal microscope test results for turning quartz glass with diamond tool[32]. (a) Cutting depth of 1 μm and feed rate of 1 μm/r; (b) cutting depth of 6 μm and feed rate of 5 μm/r
    Comparison between new ultrasonic vibration assisted machining and traditional machining[33]. (a) Conventional and ultrasonic machining setup; (b) diamond tool-sample contact movement in machining; (c) machining-induced edge chipping damage depths
    Comparison between laser and traditional glass processing technology[37]
    Progress in laser cutting and separation technology of glass materials
    Experimental setup for laser irradiation of glass samples and morphology of the bubbles (SEM imaging) formed at different laser scanning speeds[40]
    Femtosecond laser ablation process[42]. (a) Thin glass cutting process; (b) supporting jig in details; (c) experimental setup of three-point bending test and cross sectional images of cutting surface
    Schematic of laser setup and comparison before and after surface damage [47]
    Schematic of the device for forming a flowing water layer at the top of a glass sample and optical micrograph of the cutting edge on the front side of a laser cut glass strip[48]
    Kerf quality characteristics[50]
    Setup for the Bessel beam generation[51]
    Laser-induced cleaving of D263T glass by volume absorption of Bessel beams[51]
    Schematic of top-bottom cutting and bottom-top cutting, and SEM images of etched cross-section and OM images of bare front- and back-surface[52]
    Schematic of dual beam CO2 laser cutting glass and sectional view of dual beam CO2 laser thermal stress cutting glass [59]
    Schematic of FMFLS separation of thick glass and micrographs of the top and bottom slits obtained by FMFLS at P=80 W and V=1000 μm/s[31]
    • Table 1. Comparison of characteristics of traditional method and laser cutting separation technology

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      Table 1. Comparison of characteristics of traditional method and laser cutting separation technology

      CharacteristicTraditional methodLaser cutting separation technology
      Separation qualityPoorGood
      Processing accuracyLowHigh
      Processing efficiencyLowHigh
      Number of processesManyFew
      Scope of applicationNarrowWide
    • Table 2. Comparison of advantages and disadvantages of various laser separation methods

      View table

      Table 2. Comparison of advantages and disadvantages of various laser separation methods

      Separation methodSeparation qualityAdvantages and disadvantages
      Laser melting/vaporization cutting methodPoorCauses edge chipping and cracking, requires many post-processing steps
      Laser scribing cutting methodFairRequires manual separation, prone to edge damage
      Ultrafast laser material removal methodHighLimited cutting thickness, often requires multiple scans
      Ultrafast laser fiber cutting methodHighRequires manual separation, prone to edge damage
      Laser crack control methodHighRequires precise thermal and stress fields
      Multi-focus laser cutting separation methodHighSuitable for separating thick glass and laminated glass
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    Jiangtao Ni, Aowei Xing, Lijuan Ma, Dong Xie, Peng Liu, Yong Xie. Research Progress on Laser Cutting Separation of Glass Materials[J]. Laser & Optoelectronics Progress, 2025, 62(9): 0900003

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    Paper Information

    Category: Reviews

    Received: Dec. 3, 2024

    Accepted: Feb. 4, 2025

    Published Online: May. 15, 2025

    The Author Email: Xie Yong (327157800@qq.com)

    DOI:10.3788/LOP242358

    CSTR:32186.14.LOP242358

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