Fig. 1. Schematic diagram of layer distribution for InP technology

Fig. 2. Layout and dispersion curves of SSPPs unit cells. (a) Layout of unit cell of SSPPs with groove structure; (b) layout of unit cell of SSPPs with folded structure; (c) comparison of dispersion curves of unit cell of SSPPs with groove structure and unit cell of SSPPs with folded structure

Fig. 3. Dispersion characteristic of unit cell of SSPPs with folded structure varying with length of folded line L

Fig. 4. Structural diagram of proposed terahertz on-chip transmission line based on SSPPs

Fig. 5. Structural comparison diagram of SSPPs transmission line with groove structure and transmission line with folded SSPPs. (a) Structural diagram of SSPPs transmission line with groove structure; (b) structural comparison between SSPPs with groove structure and SSPPs with folded SSPPs

Fig. 6. Simulated results of proposed sub-terahertz on-chip transmission line based on SSPPs

Fig. 7. Simulated electric field distribution of proposed sub-terahertz on-chip transmission line based on SSPPs under different operating frequencies. (a) 200 GHz; (b) 500 GHz

Fig. 8. Test setup and physical picture of proposed sub-terahertz on-chip transmission line based on SSPPs. (a) On-chip test setup;(b) GSG probe for on-chip test; (c) physical picture of SSPPs transmission line

Fig. 9. Comparison between measured result and simulated result of proposed sub-terahertz on-chip transmission line based on SSPPs