Thermal Performance of High-Power Laser Diodes Packaged by SiC Ceramic Submount

Fig. 2. (a) Experimental data of temperature coefficient and linearly fitted curve; (b) transient cooling curves; (c) structure function curves of laser diodes

Download full size

Fig. 3. Electrical-optical characteristics of typical laser diodes

Download full size

Table 1. Detailed parameters of the material and structure of COS package

View table

Table 1. Detailed parameters of the material and structure of COS package

Layer	CTE /(10^-6·K^-1)	Elasticmodulus /GPa	Poissonratio	Thermal conductivity /(W·m^-1·K^-1)	Specific heat /(kJ·kg^-1·K^-1)	Thickness inexperiment /μm
GaAs	6.03	85.3	0.312	45	5.32	110
Cu-SiC	17.00	130.0	0.350	398	0.38	68
SiC	3.90	221.0	0.210	490	0.69	346
Cu-AlN	17.00	130.0	0.350	398	0.38	79
AlN	4.10	270.0	0.260	200	0.69	324

Table 2. Output characteristics of laser diodes packaged by SiC and AlN respectively at 16 A current injection
View table
Table 2. Output characteristics of laser diodes packaged by SiC and AlN respectively at 16 A current injection
Number of laser diodes Submount material Power /W Electro-optical conversion efficiency /% Wavelength /nm
SiC-1 SiC 15.9 56.8 913.3
SiC-2 SiC 15.5 55.1 913.5
AlN-1 AlN 15.0 53.2 912.8
AlN-2 AlN 15.1 53.9 912.5

Tools

Get Citation

Copy Citation Text

Ni Yuxi, Jing Hongqi, Kong Jinxia, Wang Cuiluan, Liu Suping, Ma Xiaoyu. Thermal Performance of High-Power Laser Diodes Packaged by SiC Ceramic Submount[J]. Chinese Journal of Lasers, 2018, 45(1): 101002

Download Citation

EndNote(RIS)BibTex Plain Text

Set citation alerts for article

Save article for my favorites