Journal of Inorganic Materials, Volume. 40, Issue 3, 271(2025)

(Zr, Hf, Nb, Ta, W)C-SiC Composite Ceramics: Preparation via Precursor Route and Properties

Ziwei LI1,2, Weilu GONG1,2, Haifeng CUI1, Li YE1、*, Weijian HAN1, and Tong ZHAO1,2
Author Affiliations
  • 11. Key Laboratory of Science and Technology on High-tech Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  • 22. College of Chemisty, University of Chinese Academy of Sciences, Beijing 100049, China
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    Figures & Tables(18)
    (a) TG-DTG curves of cured PHEC-PCS and (b-e) MS spectra of gases released during pyrolysis of cured PHEC-PCS
    XPS spectra of HEC-W5-SiCi obtained at different pyrolysis temperatures
    XRD patterns of PHEC-PCS pyrolyzed in the range of 600-1800 ℃
    SEM images of HEC-W5-SiCi powder pyrolyzed in the range of 600-1800 ℃
    SEM image and EDS mappings of HEC-W5-SiCi powder pyrolyzed at 1600 ℃
    (a-c) Surface SEM images and (d-f) grain size statistics of SiC in (a, d) HEC-W5-SiCi, (b, e) HEC-W5-SiCp, and (c, f) HEC-W5-SiCw bulk ceramics
    Mechanical properties of HEC-W5, HEC-W5-SiCp, HEC-W5-SiCw, and HEC-W5-SiCi ceramics
    Morphologies of crack extension of ceramics after Vickers hardness test
    Flexural strength and fracture toughness of HEC-W5- SiCi ceramics of this work and data in literature[11,14,22⇓⇓⇓⇓⇓⇓⇓⇓⇓⇓⇓ -34]
    XPS spectra of HEC-W5-SiCi
    SEM images of commercialized SiCp and SiCw
    (a) Relative density of HEC-W5 ceramics and HEC-W5-SiC ceramics, (b) XRD patterns of different EC-W5-SiC ceramics
    SEM image and EDS mappings of HEC-W5-SiCp ceramics surface
    SEM image and EDS mappings of HEC-W5-SiCw ceramics surface
    SEM images and EDS mappings of HEC-W5-SiCi ceramics surface
    • Table 1. Elemental content analysis of HEC-SiCi-1600

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      Table 1. Elemental content analysis of HEC-SiCi-1600

      Empirical formulaContent/(%, in mass)
      ZrHfNbTaWSiCO
      (Zr0.238Hf0.237Nb0.237Ta0.237W0.05)-Si0.347C1.405O0.03113.125.613.325.95.55.910.20.3
    • Table 2. Mechanical properties of HEC-W5, HEC-W5-SiCp, HEC-W5-SiCw, and HEC-W5-SiCi ceramics

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      Table 2. Mechanical properties of HEC-W5, HEC-W5-SiCp, HEC-W5-SiCw, and HEC-W5-SiCi ceramics

      SampleVickers hardness/GPa Elasticity modulus/GPa Flexural strength/MPa Fracture toughness/(MPa·m1/2) Shape factor, Y
      HEC-W523.82±0.49447.07±3.71593±155.6±0.22.537
      HEC-W5-SiCp21.79±0.78418.96±5.24675±127.1±0.52.535
      HEC-W5-SiCw21.61±0.35435.50±4.38726±186.7±0.32.533
      HEC-W5-SiCi23.03±0.63575.70±8.25698±97.9±0.62.534
    • Table 3. Flexural strength and fracture toughness of HEC-W5-SiCi ceramics and previous studies[11,14,22 -34]

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      Table 3. Flexural strength and fracture toughness of HEC-W5-SiCi ceramics and previous studies[11,14,22 -34]

      SampleFlexural strength/MPaFracture toughness/(MPa·m1/2) Ref.
      (Ti0.25Nb0.25Hf0.25Ta0.25)C0.3N0.7481±56b7.17±0.62c[22]
      (TiZrHfVNbTa)C473±21b3.6±0.2c[23]
      (Hf0.2Zr0.2Ta0.2Nb0.2Ti0.2)C400b5.9c[24]
      (Hf0.2Zr0.2Ta0.2Nb0.2Ti0.2)C450±64b4.8±0.2c[25]
      (Hf0.2Ta0.2Zr0.2Nb0.2Ti0.2)C494b2.306d[26]
      (Hf0.2Zr0.2Ti0.2Ta0.2Nb0.2)C421±27a3.5±0.3d[27]
      (Ti0.2Hf0.2Zr0.2Nb0.2Ta0.2)B2-2.83±0.15e[28]
      (Hf0.2Nb0.2Ta0.2Ti0.2Zr0.2)B2376±25b4.70±0.27c[29]
      (Ti0.2Zr0.2Hf0.2Nb0.2Ta0.2)B2339±17a3.81±0.40c[30]
      (Ti0.2Zr0.2Hf0.2Nb0.2Ta0.2)B2-20SiCp447±45a4.85±0.33c[30]
      (NbTaZrW)C-50SiCP455b6.54c[31]
      (HfZrTaTiW)C-1.5wt%SiCnw626.5b6.2e[32]
      (Ti0.2Zr0.2Hf0.2Nb0.2Ta0.2)B2-20SiCp750±43b4.12±0.20e[33]
      (Ti0.2Zr0.2Hf0.2Nb0.2Ta0.2)B2-20SiCp476±42b4.63±0.23c[34]
      (Ti0.2Zr0.2Hf0.2Nb0.2Ta0.2)C-20SiCp554±73a5.24±0.41c[11]
      HEC-W5593±15b5.6±0.2c[14]
      HEC-W5-SiCp675±12b7.1±0.5cThis work
      HEC-W5-SiCw726±18b6.7±0.3cThis work
      HEC-W5-SiCi698±9b7.9±0.6cThis work
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    Ziwei LI, Weilu GONG, Haifeng CUI, Li YE, Weijian HAN, Tong ZHAO. (Zr, Hf, Nb, Ta, W)C-SiC Composite Ceramics: Preparation via Precursor Route and Properties [J]. Journal of Inorganic Materials, 2025, 40(3): 271

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    Paper Information

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    Received: Aug. 21, 2024

    Accepted: --

    Published Online: Apr. 24, 2025

    The Author Email: Li YE (yeli@iccas.ac.cn)

    DOI:10.15541/jim20240385

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