High Power Laser and Particle Beams, Volume. 36, Issue 1, 013014(2024)

Simulation and verification of 3D temperature model for high power microwave heating

Hao Wu, Shaofu Li*, Wei Wang, Cheng Jiang, and Yingying Tang
Author Affiliations
  • School of Information Engineering, Southwest University of Science and Technology, Mianyang 621010, China
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    Figures & Tables(14)
    Microwave resonator diagram
    Schematic diagram of heat loss
    Temperature error analysis chart of 5.4 kg water
    Partition diagram of different materials
    1/2 full scale model
    Temperature distribution at 465 s
    COMSOL simulation of electric field distribution in water medium
    Temperature comparison in r and z directions
    Temperature distribution of microwave uniform heating and uneven heating in rz plane
    Block diagram of microwave heating control system
    Temperature change trend at each point
    Temperature change trend of each point under expert PID control
    • Table 1. Material parameter values of each layer

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      Table 1. Material parameter values of each layer

      material$ \rho /\left( {{\rm{kg}}\cdot {{\rm{m}}^{-3}}} \right) $$ c/\left({\rm{J}}\cdot{\rm{kg}}^{-1}\cdot {{\text{℃}}}^{-1}\right) $$ \lambda /\left({\rm{W}}\cdot{\rm{m}}^{-1}\cdot {{\text{℃}}}^{-1}\right) $
      W100042000.59
      G26008502
      A1.1810050.028
      B7930126016.2
    • Table 2. Empirical rule table of incremental expert PID control

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      Table 2. Empirical rule table of incremental expert PID control

      No.ifthen
      1u>1.00all five magnetrons run
      21.00≥u>0.75four magnetrons run randomly
      30.75≥u>0.50three magnetrons run randomly
      40.50≥u>0.25two magnetrons run randomly
      50.25≥u>0.00one magnetron run randomly
      6u≤0.00all magnetrons stop running
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    Hao Wu, Shaofu Li, Wei Wang, Cheng Jiang, Yingying Tang. Simulation and verification of 3D temperature model for high power microwave heating[J]. High Power Laser and Particle Beams, 2024, 36(1): 013014

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    Paper Information

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    Received: Aug. 22, 2023

    Accepted: Oct. 9, 2023

    Published Online: Mar. 21, 2024

    The Author Email: Li Shaofu (shaohu.li@qq.com)

    DOI:10.11884/HPLPB202436.230281

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