Fig. 1. Single-layer manufacturing process flow chart in the main manufacturing process of semiconductor chips

Fig. 2. Common chip structure diagram

Fig. 3. Diagram of surface texture on high pressure seals

Fig. 4. Diagram of micro-structure on super-lens element

Fig. 5. Harmful micro-structure diagram

Fig. 6. Schematic of dark field off-axis illumination light path

Fig. 7. Schematic of confocal microscopy imaging optical path

Fig. 8. Schematic diagram of spectral inversion and through-focus scanning

Fig. 9. Optical path schematic of low-coherence interferometric microscope

Fig. 10. “Snake” motion scanning route

Fig. 11. Physical map of the internal microscopic parts of the dark-field inspection equipment

Fig. 12. Defect detection results of Nd glass with dark field microscopy machine vision

Fig. 13. Texture defect results in TFT displays

Fig. 14. Three-dimensional topography detection results by confocal microscopy

Fig. 15. 3D topography of super-lens by white light low-coherence interferometric microscope

Fig. 16. The detection result curve of the bat wing effect

Fig. 17. White light interference fringe envelope and detect results with or without batwing-effect influence

Fig. 18. The diagram of W/3 metrology rule in ISO5436-1：2000（E）and simulation results of coupling distance of groove samples

Fig. 19. Two different modes of Linnik interference microscope

Fig. 20. Results of CD and its error between the TSOM combined with machine-learning and SEM for six samples

Fig. 21. Comparison of comb tooth groove structure tomography of a silicon MEMS sensor between SEM and self-developed instrument

Fig. 22. Comparison of equal-cycle grating structure tomography between SEM and self-developed instrument

Fig. 23. The photo of reflective nondestructive measuring system instrument with near-infrared Linnik-type interferometric microscope

Fig. 24. Images of single-groove on silicon-base with 200 μm depth imaged by Linnik-type interferometric microscope