Laser & Optoelectronics Progress, Volume. 62, Issue 7, 0700001(2025)

China's Top 10 Optical Breakthroughs: Fabrication Technology of Large-Sized Micro-Nano Optical Devices (Invited)

Bowen Sun1,2, Li Zhang1,2, Jisen Wen2, Xiaoming Shen1, Tianqi Liu1、*, Cuifang Kuang1,2、**, and Xu Liu1,2
Author Affiliations
  • 1State Key Laboratory of Extreme Photonics and Instrumentation, ZJU-Hangzhou Global Scientific and Technological Innovation Center, Zhejiang University, Hangzhou 311215, Zhejiang , China
  • 2State Key Laboratory of Extreme Photonics and Instrumentation, College of Optical Science and Engineering, Zhejiang University, Hangzhou 310027, Zhejiang , China
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    Figures & Tables(15)
    Ultraviolet projection lithography technology. (a) Schematic of principle of projection lithography[54]; (b) microstructures of the metalens fabricated by DUV lithography at 193 nm wavelength[52]; (c) a photograph of the metalens fabricated by DUV multistep lithography at 248 nm wavelength[53]; (d) microstructures of the metalens[53]; (e) image of the moon captured by the metalens telescope[53]
    Proximity lithography technology. (a) Schematic of principle of proximity lithography[58]; (b) mask design based on Talbot effect in proximity lithography[57]; (c) periodic structures fabricated by proximity lithography[57]
    Schematic of principle of holography with total internal reflection[58]. (a) Recording process of holographic mask; (b) lithography process of holographic mask
    Synthetic holographic mask lithography technology. (a) Microstructures of stair-type synthetic holographic mask[66]; (b) mask pattern, simulated spatial image intensity image, and lithographic pattern[66]; (c) binary structure synthetic holographic mask[72]
    Schematic of principle of nanoimprint technologies. (a) Thermal imprinting; (b) UV imprinting; (c) reverse imprinting
    Planar nanoimprint technology. (a) Schematic of principle of substrate conformal imprint lithography[87]; (b) mold of nanoimprint technology without demolding process[89]; (c) microstructure manufactured by nanoimprint technology without demolding process[89]; (d) flexible superlens manufactured by nanoimprint technology without demolding process[89]; (e) nanoimprint mold[90]; (f) superlens with the diameter of 6 mm[90]
    Roller nanoimprint technology. (a) Roll-to-roll nanoimprint lithography[91]; (b) schematic of multiphase numerical model with a sliding mesh method[94]
    Schematic of principle of two-photon laser direct writing lithography technology[95]
    Parallel laser direct writing lithography based on micro lens array. (a) Schematic of lithography principle of micro lens array[98]; (b) array structure with unit size of 2 μm[96]; (c) lithographic structure exposed by micro lens array[97]; (d) hexagonal micro lens array[98]
    Parallel laser direct writing lithography based on diffractive optical element. (a) Schematic of focus array of the lithography system[99]; (b) micro-nano structure manufactured by parallel laser direct writing lithography[99]; (c) planar micro-nano structure manufactured with 3×3 laser array[100]; (d) manufactured large three-dimensional micro-nano structure[100]; (e) schematic of using metasurface to simplify traditional complex imaging system[101]; (f) exposed lateral suspension line with the width of 100.8 nm[101]; (g) three-dimensional micro-nano bridges[101]
    Multifocal parallel laser direct writing lithography based on spatial light modulator. (a) Schematic of principle of tunable multifocal laser direct writing lithography system based on spatial light modulator[102]; (b)-(e) scanning electron microscope (SEM) images of various focus distribution and fabricated structures[102]; (f) schematic of principle of three-dimensional multifocal peripheral photoinhibition laser direct writing lithography system based on spatial light modulator[103]; (g) comparison of lithography results between peripheral photoinhibition lithography and two-photon lithography[103]; (h) lithographic schematic of stepped structure on a compact disc[103]
    Parallel laser direct writing lithography based on digital micromirror device. (a) Schematic of principle of laser direct writing system[49]; (b) SEM image of ORC array[49]; (c) schematic of principle of scanning system based on digital micromirror device[104]; (d) SEM image of micro-nano bridge[104]; (e) schematic of principle of simultaneous spatial and temporal focusing two-photon lithography system[48]; (f) SEM image of overhanging micro-nano structure[48]
    Electron beam direct writing lithography. (a) Cross interspersed nano-columns with different heights[106]; (b) different colors filtering realized by using nano-column arrays with different heights, sizes, and arrangements[106]; (c) exposed pattern structure by electron beam crosslinking-induced patterning technology[107]; (d) height and lateral dimension distribution of crosslinking-induced pattern structure[107]; (e) schematic of the electron beam lithography with Gaussian beam and variable shaped beam[108]; (f) schematic of principle of multiple beam electron beam lithography setup[111]; (g) dislocation distribution diagram of electron beam set[111]
    Focused ion beam direct writing lithography. (a) Reflection filter fabricated by focused ion beam direct writing lithography technology[116]; (b) molecular crystal resonators fabricated by focused ion beam direct writing lithography technology[117]
    • Table 1. Advantages and disadvantages of different lithography technologies and their typical technical parameters

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      Table 1. Advantages and disadvantages of different lithography technologies and their typical technical parameters

      Lithography technologyFeature size /nmThroughputAdvantageDisadvantage
      Projection lithography13‒38Very highLarge areaHigh cost,complicated
      Holographic mask lithography50‒200Very highLarge area, low costLow resolution
      Nanoimprint lithography10‒100HighLarge area, low costUncontrollable defect,high resolution mold
      Laser direct writing lithography30‒500Low3D fabrication, masklessLow resolution
      Electron beam lithography5‒35Very lowExtremely high resolution,masklessHigh cost
      Focused ion beam lithography20‒50Very lowHigh resolution,one-step fabrication, masklessHigh cost,ion contamination
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    Bowen Sun, Li Zhang, Jisen Wen, Xiaoming Shen, Tianqi Liu, Cuifang Kuang, Xu Liu. China's Top 10 Optical Breakthroughs: Fabrication Technology of Large-Sized Micro-Nano Optical Devices (Invited)[J]. Laser & Optoelectronics Progress, 2025, 62(7): 0700001

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    Paper Information

    Category: Reviews

    Received: Dec. 31, 2024

    Accepted: Feb. 4, 2025

    Published Online: Apr. 3, 2025

    The Author Email: Tianqi Liu (tianqiliu@zju.edu.cn), Cuifang Kuang (cfkuang@zju.edu.cn)

    DOI:10.3788/LOP242539

    CSTR:32186.14.LOP242539

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