An endoscope welding spot detection system based on FPGA image processing

Chenxin JIA; Rongfu ZHANG; Mengyuan REN; Zhaohui XU; Yangdan GONGJI; Hanlin LIU

doi:10.3969/j.issn.1005-5630.2022.005.007

Optical Instruments, Volume. 44, Issue 5, 53(2022)

An endoscope welding spot detection system based on FPGA image processing

Chenxin JIA, Rongfu ZHANG^*, Mengyuan REN, Zhaohui XU, Yangdan GONGJI, and Hanlin LIU

School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China

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References(2)

[1] [1] BUNYAK F, ERCAL F. Inspection of power ground layers in PCB images[C]Proceedings of SPIE 3521, Machine Vision Systems f Inspection Metrology VII. Boston, United States: SPIE, 1998: 190197.

[2] MAR N S S, YARLAGADDA P K D V, FOOKES C. Design and development of automatic visual inspection system for PCB manufacturing[J]. Robotics and Computer-Integrated Manufacturing, 27, 949-962(2011).

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Chenxin JIA, Rongfu ZHANG, Mengyuan REN, Zhaohui XU, Yangdan GONGJI, Hanlin LIU. An endoscope welding spot detection system based on FPGA image processing[J]. Optical Instruments, 2022, 44(5): 53

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Paper Information

Category: DESIGN AND RESEARCH

Received: Dec. 30, 2021

Accepted: --

Published Online: Nov. 14, 2022

The Author Email: Rongfu ZHANG (zrf@usst.edu.cn)

DOI:10.3969/j.issn.1005-5630.2022.005.007

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology