A 355 nm Nd:YVO4 laser with output power of 8 W and a 1064 nm Nd:YAG laser with output power of 50 W are used for etching the copper clad laminate (CCL) and flexible printed circuit (FPC). The effects of laser process parameters, such as laser power density, repetition rate, laser scanning speed and single pulse energy, on the etching quality of microstructure are studied in detail. The experimental results demonstrate that the lasers within ultraviolet (UV) range needs less power to etch the copper layer entirely and causes less thermal effect, as copper and polymer have higher absorptivity to UV. On the other hand, the infrared laser is suitable for the ablation of copper layer due to its little damage on polymer. The 355 nm UV laser is suitable for the cutting process of the pinted circut board (PCB) because it can make the facile separation of thick polymer substrates quickly.