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Acta Optica Sinica, Volume. 33, Issue 8, 823005(2013)

Thermal Analysis for LED Chip on Board Package Based on Plastic Radiator without Substrate

Chen Yingcong1、*, Wen Shangsheng1,2, and Wu Yuxiang3
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    Article index updated: Mar. 10, 2025

    The article is cited by 9 article(s) CLP online library. (Some content might be in Chinese.)
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    Chen Yingcong, Wen Shangsheng, Wu Yuxiang. Thermal Analysis for LED Chip on Board Package Based on Plastic Radiator without Substrate[J]. Acta Optica Sinica, 2013, 33(8): 823005

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    Paper Information

    Category: Optical Devices

    Received: Mar. 25, 2013

    Accepted: --

    Published Online: Jul. 9, 2013

    The Author Email: Yingcong Chen (cyc_scut@163.com)

    DOI:10.3788/aos201333.0823005

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology