Optoelectronic Technology, Volume. 42, Issue 1, 47(2022)

Analysis and Improvement of Stripe Mura in TFT‑LCD

Zhenglin ZHANG1, Shuhui CAO1, Yan WANG1, Chen LYU1, and Zhenyu FENG2
Author Affiliations
  • 1Nanjing BOE Display Technology Co., Ltd., Nanjing 20033, CHN
  • 2School of Chemistry and Chemical Engineering, Shandong University, Jinan 50100, CHN
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    Figures & Tables(17)
    Phenomenon of stripe Mura defect
    CF Glass phenomenon of stripe Mura defect after teardown
    R/G/B film thickness of OK area and NG area
    Panel ratio and glass mapping
    The density point data of BM film thickness and CD
    The SEM images of BM layer
    Development reaction
    Mechanism analysis diagram of backside exposure technology process
    Schematics of measurement of contact angle and measurement of static electricity
    Results of measurement of contact angle and measurement of static electricity
    Schematic of electrostatic interference
    Analysis diagram of undercut mechanism
    Parallel arrangement changed into Zigzag arrangement
    Cross-sectional schematic of BM after improvement
    • Table 1. Macro inspecting results of CF each layer

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      Table 1. Macro inspecting results of CF each layer

      制程抽检数量/PcsMura发生率/(%)
      BM4100
      R/G4100
      B40
      OC50
      PS50
      Final Macro30303
    • Table 2. The difference of CF BM manufacturing procedures

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      Table 2. The difference of CF BM manufacturing procedures

      机种BM光阻背面ITO背面曝光上灯背面曝光下灯BM后条纹Mura备注
      A高阻抗客诉机种量产条件
      B高阻抗
      C高阻抗
      D低阻抗很轻微
      D低阻抗对照背镀ITO层影响
      B高阻抗很轻微对照背面曝光工艺影响
    • Table 3. Influence of backside exposure process

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      Table 3. Influence of backside exposure process

      机种背面曝光上灯背面曝光下灯条纹Mura备注
      A客诉机种量产条件
      A
      A
      ACD超规NG
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    Zhenglin ZHANG, Shuhui CAO, Yan WANG, Chen LYU, Zhenyu FENG. Analysis and Improvement of Stripe Mura in TFT‑LCD[J]. Optoelectronic Technology, 2022, 42(1): 47

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    Paper Information

    Category: Research and Trial-manufacture

    Received: Jul. 25, 2021

    Accepted: --

    Published Online: Aug. 3, 2022

    The Author Email:

    DOI:10.19453/j.cnki.1005-488x.2022.01.010

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