Microelectronics, Volume. 55, Issue 1, 153(2025)

Dual-channel Microwave Power Detection Chip Based on MEMS Fixed-beams

LIANG Yuxiang, LING Yutian, and WANG Debo
Author Affiliations
  • College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210023, P R China
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    References(8)

    [1] [1] DEHE A, FRICKE-NEUDERTH K, KROZER V. Broadband thermoelectric microwave power sensors using GaAs foundry process[C]//IEEE MTT-S International Microwave Symposium Digest. Seattle, WA, USA. 2002: 1829-1832.

    [3] [3] JAEGGI D, BALTES H, MOSER D. Thermoelectric AC power sensor by CMOS technology[J]. IEEE Electron Device Letters, 1992, 13(7): 366-368.

    [4] [4] MILANOVIC V, HOPCROFT M, ZINCKE C A, et al. Optimization of CMOS MEMS microwave power sensors[C]//IEEE International Symposium on Circuits and Systems. Orlando, FL. 1999: 144-147.

    [5] [5] ESCRIBA C, CAMPO E, ESTVE D, et al. Complete analytical modeling and analysis of micromachined thermoelectric uncooled IR sensors[J]. Sensors and Actuators A: Physical, 2005, 120(1): 267-276.

    [6] [6] WANG D B, LIAO X P. A voltage source model on thermoelectric power sensor based on MEMS technology[J]. Microsystem Technologies, 2011, 17(8): 1343-1349.

    [8] [8] ZHANG Z Q, GUO Y, LI F, et al. A sandwich-type thermoelectric microwave power sensor for GaAs MMIC-compatible applications[J]. IEEE Electron Device Letters, 2016, 37(12): 1639-1641.

    [9] [9] ZHANG Z Q, MA Y. DC-25 GHz and low-loss MEMS thermoelectric power sensors with floating thermal slug and reliable back cavity based on GaAs MMIC technology[J]. Micromachines, 2018, 9(4): 154.

    [10] [10] LI J H, LIAO X P, CHU C L. Electromagnetic-thermal-electric analysis of indirectly-heated RF MEMS power sensors with different terminal resistor dimensions[J]. IEEE Sensors Journal, 2021, 21(4): 4342-4349.

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    LIANG Yuxiang, LING Yutian, WANG Debo. Dual-channel Microwave Power Detection Chip Based on MEMS Fixed-beams[J]. Microelectronics, 2025, 55(1): 153

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    Paper Information

    Category:

    Received: Feb. 24, 2024

    Accepted: Jun. 19, 2025

    Published Online: Jun. 19, 2025

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.240040

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