Acta Optica Sinica, Volume. 43, Issue 8, 0822001(2023)

Design, Fabrication, and Imaging of Meta-Devices

Borui Leng1, Muku Chen1,2,3, and Tsai Dinping1,2,3、*
Author Affiliations
  • 1Department of Electrical Engineering, City University of Hong Kong, Hong Kong 999077, China
  • 2Centre for Biosystems, Neuroscience, and Nanotechnology, City University of Hong Kong, Hong Kong 999077, China
  • 3State Key Laboratory of Terahertz and Millimeter Waves, City University of Hong Kong, Hong Kong 999077, China
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    Figures & Tables(16)
    Schematic of the topics in this review
    Process of the design, fabrication, and characterization for meta-devices
    Design principles of broadband achromatic meta-lens[30]. (a) Schematic of achromatic meta-lens; (b) shifted phase distribution for broadband achromatic meta-lens at different wavelengths; (c) schematic of the Pancharatnam-Berry phase, the rotation angle θ of meta-atom results in a 2θ phase change; (d) IRUs with various phase compensations over continuous and broad bandwidth; (e) optical image of the broadband achromatic meta-lens in the near-infrared region; (f) corresponding zoom-in SEM image
    Characteristics of the achromatic meta-lens[30]. (a) Schematic of experimental setup for focusing measurement; (b) measured (top) and simulated (bottom) light intensity profiles at different wavelengths when NA=0.268; (c) measured focal length at different wavelengths; (d)(e) measured FWHM and operation efficiency at focal plane
    Process and SEM images of electron-beam lithography. (a) Schematic of fabrication process for bottom-up method[30]; (b) SEM image of the fabricated achromatic meta-lens[30]; (c) schematic of fabrication process for top-down method[48]; (d) SEM image of the fabricated GaN meta-lens[48]
    Metasurfaces fabricated by direct-write lithography. (a) SEM image of the FIB-fabricated metasurface[59]; (b) schematic of the fabricated metasurface using LDW in print circuit board (PCB) technology[61]; (c) schematic of a metasurface fabricated by orthogonal LIL[49]; (d) SEM image of the anisotropic metasurface produced by LIL[62]
    Etched structure and SEM images of plasmonic lithography. (a) Schematic of the imaging reflective plasmonic lithography structure with a silver lens[64]; (b) SEM image of the corresponding Cr mask for reflective plasmonic lithography[64]; (c) schematic of plasmonic cavity lithography system consisting of a Cr mask and a Ag/PR/Ag plasmonic cavity[65]; (d) SEM image of the corresponding Cr mask patterns[65]
    Metasurfaces fabricated by nano-imprint lithography. (a) SEM images of metasurfaces with nanostripe (left) and nanohole (right) structures fabricated by thermal-NIL[66]; (b) corresponding schematic of imprinting molds for nanostripes (upper) and nanoholes (bottom)[66]; (c)(d) SEM images of thermal-NIL-fabricated metasurfaces[51, 67]; (e) SEM images of UV-NIL-defined metasurface[68]; (f) photograph of packaged metasurface emitter constructed by UV-NIL[69]
    Self-assembly lithography. (a) SEM image of self-assembled PS shperes for NL; (b) SEM images of Si-cylinder metasurface formed with NL and RIE; (c) schematic of the main fabricating procedures for the flexible, all-dielectric metasurface[70]; (d) schematic of the multi-angled deposition for metasurface realization; (e) schematic and SEM images of the features under different projection angle[72]; (f) schematic of the fabrication of Moiré metasurfaces by the NL technique; (g) SEM images of two representative Moiré metasurfaces with in-plane rotation angle at θ=12° and θ=19°[73]
    Process and SEM images of hybrid patterning lithography & photolithography. (a) Schematic of fabrication process flow for micro-sphere projection lithography[74]; (b) SEM image of a non-periodic metasurface by projection lithography (left) and the corresponding zoom-in image (right),and the scale bars are 20 μm and 5 μm, respectively[74]; (c) schematic of the fabrication process for tilted nano-pillars using hole-mask colloidal lithography and off-normal deposition[52]; (d) SEM images for the fabricated samples with various tilting angles,and the scale bar is 500 nm[52]; (e) fabrication procedures for meta-lens using DUV projection lithography[75]; (f) photo and SEM image of meta-lens on glass wafer[75]
    Metasurface-based polarization generation and imaging. (a) Schematic of metasurface for versatile polarization generation and separation (left) and the simulated conversion efficiency for each polarization (right)[13]; (b) diagram of a background-free metasurface-based QWP (left) and full wave simulations of degree of circular polarization and the extraordinary beam intensity (right)[76]; (c) left panel: SEM images of the top and side views for multispectral chiral meta-lens; right panel: captured images from color camera of beetle (top) and one-dollar coin (bottom)[82]; (d) left panel: schematic of corresponding polarization state on metapixels for the polarization camera; right panel: 3D metapixel splitting and focusing of different polarization states to different positions[87]
    Meta-lens light-field imaging and sensing. (a) Left panel: light-field imaging and rendered images (top), rendered images of rocket at different depths (middle), and estimated depth map (bottom); right panel: rendered image formed by achromatic meta-lens array with incident white light[23]; (b) schematic of the depth-sensing system composed of meta-lens array[39]; (c) integral imaging given by achromatic meta-lens array at incident white light; (d) reconstructed images with different depth planes[93]; (e) schematic of light-field imaging system with multi-dimensional edge detection[94]; (f) meta-lens for aerial photography and landing assist system (left), experimental (upper-right) and simulated (bottom-right) imaging properties at different height[40]
    Application of meta-lens in the field of biomedical imaging. (a) Schematic of light-sheet fluorescence microscopy and LSFM image for C. elegans (upper right)[96]; (b) schematic of generation of AAF beam and the required phase distribution on metasurface (bottom left); (c) bright-field (upper left) and wide-field (upper right) images of the fluorescence-tagged mouse cardiac slice, the corresponding fluorescence intensity profiles for the red box region (bottom)[97]; (d) schematic of Moiré meta-lens; (e) upper panel: fluorescent image of villi under uniform illumination and HiLo processed image (right) of villi; bottom panel: experimental and simulated focal length and measured efficiency[98]
    • Table 1. Properties of direct-write lithography

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      Table 1. Properties of direct-write lithography

      PropertyParticle beamMechanicsLaser
      Electron-beamFocused-ion beamProbe scanningDirect writingInterference
      Supreme propertyHigh resolutionMilling under direct visualizationVacuum chamber freeLow costHigh speed
      Good qualityLarge areaLarge area
      Main challengeProximity effectIon beam damagePoor aspect ratioNo batch processOnly for periodic structures
      High costHigh costHigh cost
    • Table 2. Properties of pattern transfer lithography

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      Table 2. Properties of pattern transfer lithography

      PropertyPlasmonNano-imprintSelf-assembly
      Supreme propertyHigh throughputHigh yieldLarge area
      Mass productionLow cost
      High speed
      Main challengeLarge area photomaskHigh resolution moldUniformity
      Residual imprint layerLimited patterns
    • Table 3. Properties of hybrid patterning lithography

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      Table 3. Properties of hybrid patterning lithography

      PropertyMicro-sphere projection lithographyHole-mask colloid & off-normal deposition
      Supreme propertyRapid designLarge area
      Large areaTilted structure
      Low cost
      Main challengeUniformityUniformity
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    Borui Leng, Muku Chen, Tsai Dinping. Design, Fabrication, and Imaging of Meta-Devices[J]. Acta Optica Sinica, 2023, 43(8): 0822001

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    Paper Information

    Category: Optical Design and Fabrication

    Received: Oct. 25, 2022

    Accepted: Nov. 25, 2022

    Published Online: Apr. 6, 2023

    The Author Email: Dinping Tsai (dptsai@cityu.edu.hk)

    DOI:10.3788/AOS221877

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