Chinese Journal of Lasers, Volume. 43, Issue 5, 503008(2016)

Pulse Fiber Laser Controlled Fracture Cutting of Ultrathin Strontium Titanate Ceramic Substrate

Jiang Wei*, Xie Xiaozhu, Wei Xin, Hu Wei, Ren Qinglei, and Weng Qing
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  • [in Chinese]
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    Strontium titanate ceramics with the feature of soft and brittle is difficult to process by mechanical processing method, because this method can easily cause crack and scratch on the surface. Master oscillator power amplifier (MOPA) pulsed fiber laser is conducted to controlled fracture cutting strontium titanate ceramic substrate. The mechanism of laser controlled fracture cutting is revealed as follows. Firstly the grooves formed by laser ablation. The groove depth then increases with the increase of the scanning times. When the thermal stress reaches the fracture threshold value of the material, the crack extends along the stress groove until it is completely split. It is an adaptive splitting process without the subsequent breaking procedure. In addition, it is found that the surface flattening and smoothing phenomenon occurr in laser ablation of material. Strontium titanate ceramic substrate with the thickness of 0.3 mm can be shape cut by selecting appropriate laser processing parameters.

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    Jiang Wei, Xie Xiaozhu, Wei Xin, Hu Wei, Ren Qinglei, Weng Qing. Pulse Fiber Laser Controlled Fracture Cutting of Ultrathin Strontium Titanate Ceramic Substrate[J]. Chinese Journal of Lasers, 2016, 43(5): 503008

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    Paper Information

    Category: laser manufacturing

    Received: Jan. 12, 2016

    Accepted: --

    Published Online: May. 4, 2016

    The Author Email: Jiang Wei (jiangweime@outlook.com)

    DOI:10.3788/cjl201643.0503008

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