Chinese Journal of Lasers, Volume. 39, Issue 4, 402010(2012)

Analysis on Overall Thermal Resistance of Laser Diode Beam Combined Modules

Zhang Zhijun1,2、*, Liu Yun1, Fu Xihong1, Shan Xiaonan1, Zhu Hongbo1,2, and Wang Lijun1
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  • 2[in Chinese]
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    References(14)

    [1] [1] Tang Chun, Wu Deyong, Yan Diyong et al.. High-duty cycle high power linear array diode laser package technique[J]. High Power Laser and Particle Beams, 2000, 12(5): 544~546

    [5] [5] Zhuang Jun. Heat Pipe Technology and Engineering Application[M]. Beijing: Chemical Industry Press, 2000. 196~198

    [6] [6] Tao Wenquan. Numerical Heat Transfer[M]. Xi′an: Xi′an Jiaotong University Press, 2004. 485~488

    [7] [7] Huang Dexiu, Liu Xuefeng. Semiconductor Lasers and Their Applications[M]. Beijing: National Defence Industry Press, 1999. 107~109

    [8] [8] Jiang Jianping. Semiconductor Lasers[M]. Beijing: Publishing House of Electronics Industry, 2000. 91

    CLP Journals

    [1] Yang Yang, Yu Guolei, Li Peixu, Xia Wei, Xu Xiangang. Measurement and Analysis of Junction Temperature of Semiconductor Laser Devices[J]. Laser & Optoelectronics Progress, 2016, 53(1): 11404

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    Zhang Zhijun, Liu Yun, Fu Xihong, Shan Xiaonan, Zhu Hongbo, Wang Lijun. Analysis on Overall Thermal Resistance of Laser Diode Beam Combined Modules[J]. Chinese Journal of Lasers, 2012, 39(4): 402010

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    Paper Information

    Category: Laser physics

    Received: Nov. 8, 2011

    Accepted: --

    Published Online: Mar. 30, 2012

    The Author Email: Zhang Zhijun (zzjciomp@163.com)

    DOI:10.3788/cjl201239.0402010

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