Journal of Infrared and Millimeter Waves, Volume. 42, Issue 1, 122(2023)

Low power application specific SoC chip for uncooled infrared image processing

Guang-Hao GUO1...2, Nan-Jian WU1,2,*, and Li-Yuan LIU12 |Show fewer author(s)
Author Affiliations
  • 1State Key Laboratory for Superlattices and Microstructures,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China
  • 2College of Materials Sciences and Opto-Electronic Technology,University of Chinese Academy of Sciences,Beijing 100049,China
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    Figures & Tables(17)
    Architecture of infrared image processing SOC chip system
    Structure of image preprocessing module
    Flow chart of nonuniformity correction algorithm
    Structure of image enhancement module
    Verification of stripe elimination (a) Original image with stripe noise (b) Verification of line offset correction of regional mean (c) Verification of frequency domain 2D median filtering (d) Verification of adaptive filtering of LMS
    Verification of scene-based nonuniformity correction (a) original diagram before correction (b) Verification of neural network method (c) Verification of high pass filter correction
    Verification of image enhancement (a) Original diagram (b)Verification of Retinex algorithm (c)Verification of global histogram equalization (d)Verification of transform domain enhancement -logarithmic transform
    Infrared image processing SoC chip (a)SoC chip layout(b)SoC die
    Infrared imaging device (a) 1 280×1 024 uncooled infrared imaging device,(b) 1 024×768 uncooled infrared imaging device
    Miniaturized low power infrared detection microsystem movement, principle prototype and imaging (a) 1 024×768 imaging movement. (b) 1 280×1 024 infrared detection system principle prototype, (c) Imaging of 1 024×768, (d) Imaging of 1 280×1 024
    Nonuniformity correction test effect of 1 280×1 024 imaging microsystem principle prototype (a) no NUC in readout circuit, no NUC in SoC chip. (b) NUC in readout circuit chip, no NUC in SoC chip (c) NUC in readout circuit chip + NUC in SoC chip
    Diagram of target detection and target tracking of 1 280×1 024 imaging microsystem principle prototype
    • Table 1. Comparison of quantitative evaluation indicators for each fringe elimination algorithm in Figure 5

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      Table 1. Comparison of quantitative evaluation indicators for each fringe elimination algorithm in Figure 5

      评价指标

      原始

      图像

      区域均值的行偏置频域二维中值滤波LMS的自适应滤波
      峰值信噪比(PSNR)--19.851 428.290 125.286 6
      均方根误差(RMSE)025.939 99.818 313.874 3
      粗糙度(ρ0.112 90.081 60.08120.101
    • Table 2. Comparison of quantitative evaluation indicators for each scene based correction algorithms in Figure 6

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      Table 2. Comparison of quantitative evaluation indicators for each scene based correction algorithms in Figure 6

      评价指标

      原始

      图像

      神经

      网络法

      高通

      滤波法

      恒定统计平均
      峰值信噪比(PSNR)--10. 110 910. 078 58.849 8
      均方根误差(RMSE)079. 615 379. 912 892.055 4
      粗糙度(ρ0.504 90.185 30.367 20.224 2
    • Table 3. Comparison of quantitative evaluation indicators for Image enhancement algorithm in Figure 7

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      Table 3. Comparison of quantitative evaluation indicators for Image enhancement algorithm in Figure 7

      评价指标原始图像Retinex算法全局直方图均衡变换域增强-对数变换
      信息熵(IE)5.201 46.285 97.821 76.384 1
      平均梯度(AVG)3.235 74.516 46.521 44.431 2
      峰值信噪比(PSNR)--21.765 47.477 416.754 6
    • Table 4. Design index of infrared image processing SOC chip

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      Table 4. Design index of infrared image processing SOC chip

      标类型设计值
      芯片物理参数尺寸6 mm×6 mm;小于1.2 W;设计工艺65 nm。
      处理器参数2核DSP,400 MHz,DSP核单周期完成64次16 bit MAC;单核CPU,200 MHz片上存储1.5 MB。
      图像处理加速器参数
      功能非均匀校正、图像滤波、条纹消除、图像增强。
      工作频率250 MHz。
      接口参数
      通用接口2个SPI;2个UART;32个GPIO;1个I2C;2个CAN 总线接口。
      Ethernet接口支持百兆和千兆网口。
      图像输出接口Cameralink:1个,60 fps,1 280×1 024,LVDS输出;PAL:1个,标准输出。
      DDRDDR3,工作频率400 MHz,32位,支持1GB DDR容量。
      AD接口8通道,16 bit,支持并行及LVDS格式。
    • Table 5. Specifications of uncooled infrared imaging device

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      Table 5. Specifications of uncooled infrared imaging device

      指标类型具体指标
      成像器件探测波段7-14 μm
      成像器件分辨率1 280×1 024
      成像器件像元尺寸12 μm
      成像帧率30 fps
      图像输出格式LVDS格式输出
      NETDNETD<40 mK(@F/1.0,25 Hz 300 K)
      成像器件尺寸20.9 mm×19.9 mm×1.3 mm
      封装重量<2 g
      典型功耗<450 mW @25 Hz,300 K
      工作温度-40℃~+85℃
      封装形式WLCSP晶圆级封装
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    Guang-Hao GUO, Nan-Jian WU, Li-Yuan LIU. Low power application specific SoC chip for uncooled infrared image processing[J]. Journal of Infrared and Millimeter Waves, 2023, 42(1): 122

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    Paper Information

    Category: Research Articles

    Received: Apr. 9, 2022

    Accepted: --

    Published Online: Feb. 23, 2023

    The Author Email: Nan-Jian WU (nanjian@red.semi.ac.cn)

    DOI:10.11972/j.issn.1001-9014.2023.01.015

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