Opto-Electronic Engineering, Volume. 43, Issue 9, 84(2016)

Thermal Design, Calculation and Verification of Digital Micro-mirror Device

WANG Fei, ZHOU Liansheng, FANG Bin, TIAN Wei, ZHANG Wei, and SUI Yongxin
Author Affiliations
  • [in Chinese]
  • show less
    References(12)

    [1] [1] SUN Huiling,ZHAO Yu,GAO Zhiqiang,et al. Investigation on Optical Engine of Stereoscopic Projector [J]. Journal of Nanjing University of Posts and Telecommunications:Natural Science,2012,32(4):91-96.

    [3] [3] GAO Shan. Study of the Thermal Modeling Methods and Thermal Design for Circuit Assembly [D]. Chengdu:University of Electronic Science and Technology of China,2013:1-2.

    [4] [4] LI Chenglong. Study of Electronic Products Thermal Design and Simulation Techniques Application [D]. Chengdu:University of Electronic Science and Technology of China,2010:1.

    [7] [7] WEI Wei. Thermal Simulation Cooling Design of Embedded Micro Projector [D]. Chengdu:University of Electronic Science and Technology of China,2012:1.

    [9] [9] DONG Bing. Optical System Design of Micro-projector [D]. Changchun:Changchun University of Science and Technology, 2011:2-3.

    [10] [10] HE Zhen. Heat Dissipation Design and Verification for DLP Handheld Pico-projector [D]. Shanghai:Shanghai Jiao Tong University,2013:5-6.

    [11] [11] YU Jianzu. Thermal Design and Analysis Techniques of Electronic Equipment [M]. Beijing:Higher Education Press,2002: 65-66.

    [12] [12] ZHANG Huguang. Handbook of Electrical & Electronic Insulation Technology [M]. Beijing:China Machine Press,2008: 482.

    Tools

    Get Citation

    Copy Citation Text

    WANG Fei, ZHOU Liansheng, FANG Bin, TIAN Wei, ZHANG Wei, SUI Yongxin. Thermal Design, Calculation and Verification of Digital Micro-mirror Device[J]. Opto-Electronic Engineering, 2016, 43(9): 84

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category:

    Received: Mar. 8, 2016

    Accepted: --

    Published Online: Dec. 9, 2016

    The Author Email:

    DOI:10.3969/j.issn.1003-501x.2016.09.015

    Topics