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Photonics Research, Volume. 11, Issue 2, 143(2023)

16-channel photonic–electric co-designed silicon transmitter with ultra-low power consumption

Jingbo Shi1,7、†,*, Ming Jin1、†, Tao Yang2, Haowen Shu1, Fenghe Yang3, Han Liu4, Yuansheng Tao1, Jiangrui Deng1, Ruixuan Chen1, Changhao Han1, Nan Qi4,5,8、*, and Xingjun Wang1,6,9、*
Author Affiliations
  • 1State Key Laboratory of Advanced Optical Communication Systems and Networks, School of Electronics, Peking University, Beijing 100871, China
  • 2College of Engineering, Peking University, Beijing 100871, China
  • 3Peking University Yangtze Delta Institute of Optoelectronics, Nantong 226010, China
  • 4State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • 5Center of Material Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
  • 6Frontier Science Center for Nano-optoelectronics, Peking University, Beijing 100871, China
  • 7e-mail: jingboshi@pku.edu.cn
  • 8e-mail: qinan@semi.ac.cn
  • 9e-mail: xjwang@pku.edu.cn
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    [1] R. G. Beausoleil, M. McLaren, N. P. Jouppi. Photonic architectures for high-performance data centers. IEEE J. Sel. Top. Quantum Electron., 19, 3700109(2013).

    [2] M. A. Taubenbaltt. Optical interconnects for high-performance computing. J. Lightwave Technol., 30, 448-457(2012).

    [3] N. Savage. Linking with light high-speed optical interconnects. IEEE Spectr., 39, 32-36(2002).

    [4] C. Kachris, I. Tomkos. A survey on optical interconnects for data centers. IEEE Commun. Surv. Tut., 14, 1021-1036(2012).

    [5] K. Wang, C. Lim, E. Wong, K. Alameh, S. Kandeepan, E. Skafidas. High-speed reconfigurable free-space optical interconnects with carrierless-amplitude-phase modulation and space-time-block code. J. Lightwave Technol., 37, 627-633(2019).

    [6] Y. Shen, X. Meng, Q. Cheng, S. Rumley, N. Abrams, A. Gazman, E. Manzhosov, M. S. Glick, K. Bergman. Silicon photonics for extreme scale systems. J. Lightwave Technol., 37, 245-259(2019).

    [7] T. Alexoudi, N. Terzenidis, S. Pitris, M. M. Pegios, P. Maniotis, C. Vagionas, C. Mitsolidou, G. M. Alexandris, G. T. Kanellos, A. Miliou, K. Vyrsokinos, N. Pleros. Optics in computing: from photonic network-on-chip to chip-to-chip interconnects and disintegrated architectures. J. Lightwave Technol., 37, 363-379(2019).

    [8] K. Bergman. Photonic networks for intra-chip, inter-chip, and box-to-box interconnects in high performance computing. European Conference on Optical Communication, Tu1.2.1(2006).

    [9] D. A. B. Miller. Rationale and challenges for optical interconnects to electronic chips. Proc. IEEE, 88, 728-749(2000).

    [10] A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, M. B. Ritter. “Exploitation of optical interconnects in future server architectures. IBM J. Res. Dev., 49, 755-775(2005).

    [11] L. Schares, J. A. Kash, F. E. Doany. Terabus: terabit/second-class card-level optical interconnect technologies. IEEE J. Sel. Topics Quantum Electron., 12, 1032-1044(2006).

    [12] M. J. R. Heck, H. Chen, A. W. Fang, B. R. Koch, D. Liang, H. Park, M. N. Sysak, J. E. Bowers. Hybrid silicon photonics for optical interconnects. IEEE J. Sel. Topics Quantum Electron., 17, 333-346(2011).

    [13] H. Subbaraman, X. Xu, A. Hosseini, X. Zhang, Y. Zhang, D. Kwong, R. T. Chen. Recent advances in silicon-based passive and active optical interconnects. Opt. Express, 23, 2487-2511(2015).

    [14] D. Dai, J. E. Bowers. Silicon-based on-chip multiplexing technologies and devices for Peta-bit optical interconnects. Nanophotonics, 3, 283-311(2014).

    [15] N. Kirman, M. Kirman, R. K. Dokania, J. F. Martinez, A. B. Apsel, M. A. Watkins, D. H. Albonesi. Leveraging optical technology in future bus-based chip multiprocessors. 39th Annual IEEE/ACM International Symposium on Microarchitecture, 492-503(2006).

    [16] C. Batten, A. Joshi, J. Orcutt, A. Khilo, B. Moss, C. W. Holzwarth, M. A. Popovic, H. Li, H. I. Smith, J. L. Hoyt, F. X. Kartner, R. J. Ram, V. Stojanovic, K. Asanovic. Building many-core processor-to-DRAM networks with monolithic CMOS silicon photonics. IEEE Micro, 29, 8-21(2009).

    [17] R. G. Beausoleil. Large-scale integrated photonics for high-performance interconnects. ACM J. Emerg. Technol. Comput. Syst., 7, 1-54(2011).

    [18] M. A. Taubenblatt. Optical interconnects for high-performance computing. J. Lightwave Technol., 30, 448-457(2012).

    [19] R. Beausoleil, J. Ahn, N. Binkert, A. Davis, D. Fattal, M. Fiorentino, N. Jouppi, M. McLaren, C. Santori, R. Schreiber, S. Spillane, D. Vantrease, Q. Xu. A nanophotonic interconnect for high-performance many-core computation. 16th IEEE Symposium on High-Performance Interconnects, 182-189(2008).

    [20] C. Minkenberg, N. Farrington, A. Zilkie, D. Nelson, C. Lai, D. Brunina, J. Byrd, B. Chowdhuri, N. Kucharewski, K. Muth, A. Nagra, G. Rodriguez, D. Rubi, T. Schrans, P. Srinivasan, Y. Wang, C. Yeh, A. Rickman. Reimagining datacenter topologies with integrated silicon photonics. J. Opt. Commun. Netw., 10, B126-B139(2018).

    [21] R. Meade, S. Ardalan, M. Davenport, J. Fini, C. Sun, M. Wade, A. Gladstein, C. Zhang. TeraPHY: a high-density electronic-photonic chiplet for optical I/O from a multi-chip module. Optical Fiber Communications Conference and Exhibition (OFC), M4D.7(2019).

    [22] D. Kuchta, J. Proesel, F. Doany, W. Lee, T. Dickson, H. Ainspan, M. Meghelli, P. Pepeljugoski, X. Gu, M. Beakes, M. Schultz, M. Taubenblatt, P. Fortier, C. Dufort, E. Turcotte, M.-O. Pion, C. Bureau, F. Flens, G. Light, B. Trekell, K. Koski. Multi-wavelength optical transceivers integrated on node (MOTION). Optical Fiber Communications Conference and Exhibition (OFC), M4D.6(2019).

    [23] G. Denoyer, A. Chen, B. Park, Y. Zhou, A. Santipo, R. Russo. Hybrid silicon photonic circuits and transceiver for 56  Gb/s NRZ 2.2 km transmission over single mode fiber. European Conference on Optical Communication (ECOC), 1-3(2014).

    [24] Y. Ma, C. Williams, M. Ahmed, A. Elmoznine, D. Lim, Y. Liu, R. Shi, T. Huynh, J. Roman, A. Ahmed, L. Vera, Y. Chen, A. Horth, H. Guan, K. Padmaraju, M. Streshinsky, A. Novack, R. Sukkar, R. Younce, A. Rylyakov, D. Scordo, M. Hochberg. An all-silicon transmitter with co-designed modulator and DC-coupled driver. Optical Fiber Communication Conference (OFC), Tu2A.2(2019).

    [25] H. Li, G. Balamurugan, M. Sakib, J. Sun, J. Driscoll, R. Kumar, H. Jayatilleka, H. Rong, J. Jaussi, B. Casper. A 112  Gb/s PAM4 silicon photonics transmitter with microring modulator and CMOS driver. J. Lightwave Technol., 38, 131-138(2020).

    [26] H. Li, G. Balamurugan, M. Sakib, R. Kumar, H. Jayatilleka, H. Rong, J. Jaussi, B. Casper. A 3D-integrated microring-based 112  Gb/s PAM-4 silicon-photonic transmitter with integrated nonlinear equalization and thermal control. IEEE International Solid- State Circuits Conference (ISSCC), 208-210(2020).

    [27] H. Zhang, M. Li, Y. Zhang, D. Zhang, Q. Liao, J. He, S. Hu, B. Zhang, L. Wang, X. Xiao, N. Qi, S. Yu. 800  Gbit/s transmission over 1  km single-mode fiber using a four-channel silicon photonic transmitter. Photon. Res., 8, 1776-1782(2020).

    [28] Q. Liao, N. Qi, M. Li, S. Hu, J. He, B. Yin, J. Shi, J. Liu, P. Y. Chiang, X. Xiao, N. Wu. A 50-Gb/s PAM4 Si-photonic transmitter with digital-assisted distributed driver and integrated CDR in 40  nm CMOS. IEEE J. Solid-State Circuits, 55, 1282-1296(2020).

    [29] K. Li, S. Liu, D. Thomson, W. Zhang, X. Yan, F. Meng, C. Littlejohns, H. Du, M. Banakar, M. Ebert, W. Cao, D. Tran, B. Chen, A. Shakoor, P. Petropoulos. Electronic–photonic convergence for silicon photonics transmitters beyond 100  Gbps on–off keying. Optica, 7, 1514-1516(2020).

    [30] E. Temporiti, G. Minoia, M. Repossi, D. Baldi, A. Ghilioni, F. Svelto. A 56  Gb/s 300  mW silicon-photonics transmitter in 3D-integrated PIC25G and 55    nm BiCMOS technologies. IEEE International Solid-State Circuits Conference (ISSCC), 404-405(2016).

    [31] L. Chen, C. Doerr, P. Dong, Y. Chen. Monolithic silicon chip with 10  modulator channels at 25  Gbps and 100-GHz spacing. Opt. Express, 19, B946-B951(2011).

    [32] K. Li, D. Thomson, S. Liu, F. Meng, A. Shakoor, A. Khokhar, W. Cao, W. Zhang, P. Wilson, G. Reed. Co-design of electronics and photonics components for silicon photonics transmitters. European Conference on Optical Communication (ECOC), 1-3(2018).

    [33] R. Ashok, S. Naaz, R. Kamran, S. Gupta. Analog domain carrier phase synchronization in coherent homodyne data center interconnects. J. Lightwave Technol., 39, 6204-6214(2021).

    [34] A. Rizzo, A. Novick, V. Gopal, B. Kim, X. Ji, S. Daudlin, Y. Okawachi, Q. Cheng, M. Lipson, A. Gaeta, K. Bergman. Integrated Kerr frequency comb-driven silicon photonic transmitter. arXiv(2021).

    [35] H. Shu, L. Chang, Y. Tao, B. Shen, W. Xie, M. Jin, A. Netherton, Z. Tao, X. Zhang, R. Chen, B. Bai, J. Qin, S. Yu, X. Wang, J. Bowers. Microcomb-driven silicon photonic systems. Nature, 605, 457-463(2022).

    [36] Y. Tao, H. Shu, X. Wang, M. Jin, Z. Tao, F. Yang, J. Shi, J. Qin. Hybrid-integrated high-performance microwave photonic filter with switchable response. Photon. Res., 9, 1569-1580(2021).

    [37] E. Sentieri, T. Copani, A. Paganini, M. Traldi, A. Palladino, A. Santipo, L. Gerosa, M. Repossi, G. Catrini, M. Campo, F. Radice, A. Diodato, R. Pelleriti, D. Baldi, L. Tarantini, L. Maggi, G. Radaelli, S. Cervini, F. Clerici, A. Moroni. A 4-channel 200 Gb/s PAM-4 BiCMOS transceiver with silicon photonics front-ends for gigabit ethernet applications. IEEE International Solid-State Circuits Conference (ISSCC), 210-212(2020).

    [38] M. Cignoli, G. Minoia, M. Repossi, D. Baldi, A. Ghilioni, E. Temporiti, F. Svelto. A 1310  nm 3D-integrated silicon photonics Mach-Zehnder-based transmitter with 275  mW multistage CMOS driver achieving 6  dB extinction ratio at 25  Gb/s. IEEE International Solid-State Circuits Conference (ISSCC), 416-417(2015).

    [39] E. Temporiti, G. Minoia, M. Repossi, D. Baldi, A. Ghilioni, F. Svelto. A 56  Gb/s 300  mW silicon-photonics transmitter in 3D-integrated PIC25G and 55  nm BiCMOS technologies. IEEE International Solid-State Circuits Conference (ISSCC), 404-405(2016).

    [40] G. Denoyer, C. Cole, A. Santipo, R. Russo, C. Robinson, L. Li, Y. Zhou, J. Chen, B. Park, F. Boeuf, S. Cremer, N. Vulliet. Hybrid silicon photonic circuits and transceiver for 50  Gb/s NRZ transmission over single-mode fiber. J. Lightwave Technology., 33, 1247-1254(2015).

    [41] C. Li, K. Yu, J. Rhim, K. Zhu, N. Qi, M. Fiorentino, T. Pinguet, M. Peterson, V. Saxena, S. Palermo. A 3D-integrated 56  Gb/s NRZ/PAM4 reconfigurable segmented Mach-Zehnder modulator-based Si-photonics transmitter. IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 32-35(2018).

    [42] S. Kanazawa, T. Fujisawa, K. Takahata, Y. Ueda, H. Ishii, R. Iga, W. Kobayashi, H. Sanjoh. Flip-chip interconnection technique for beyond 100  Gb/s (4 × 25.8  Gb/s) EADFB laser array transmitter. J. Lightwave Technol., 34, 296-302(2016).

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    Jingbo Shi, Ming Jin, Tao Yang, Haowen Shu, Fenghe Yang, Han Liu, Yuansheng Tao, Jiangrui Deng, Ruixuan Chen, Changhao Han, Nan Qi, Xingjun Wang, "16-channel photonic–electric co-designed silicon transmitter with ultra-low power consumption," Photonics Res. 11, 143 (2023)

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    Paper Information

    Category: Silicon Photonics

    Received: Jul. 4, 2022

    Accepted: Nov. 19, 2022

    Published Online: Jan. 10, 2023

    The Author Email: Jingbo Shi (jingboshi@pku.edu.cn), Nan Qi (qinan@semi.ac.cn), Xingjun Wang (xjwang@pku.edu.cn)

    DOI:10.1364/PRJ.469556

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology