Fig. 1. Schematic diagram of laser ionization mass spectrometry

Fig. 2. Schematic diagrams of particle distributions after laser-solid interaction^[21]. (a) Narrow-angle particle distribution in vacuum condition; (b) wide-angle particle distribution caused by collisions between laser and ambient gases under low-pressure buffer gas condition

Fig. 3. Approximate time scales of ns and fs laser energy absorptions and corresponding physical processes during and after laser pulse is applied^[27]. (a) ns laser; (b) fs laser

Fig. 4. Laser-solid interaction. (a) ns laser-solid interaction; (b) fs laser-solid interaction

Fig. 5. Measured laser energy as a function of intensity of generated Al signal using densely sintered AlN and AlN powders at different wavelengths^[39]. (a) Densely sintered AlN; (b) AlN powder

Fig. 6. Relationship between yield of Cu ions and laser fluence at infrared/ultraviolet wavelengths^［44］

Fig. 7. Determined relative sensitivity coefficients of elements in different substrates using different laser ablations^[48]. (a) ns laser with power density of 9×10¹⁰ W·cm^-2; (b) fs laser with power density of 9×10¹³ W·cm^-2

Fig. 8. Schematic diagrams of several commonly used mass analysis techniques

Fig. 9. Schematic diagram of TOF-MS

Fig. 10. Schematic diagrams of LI-TOF-MS^[21]. (a) On-axis reflection LI-TOF-MS with particle ejection direction parallel to extraction direction; (b) orthogonal reflection LI-TOF-MS with particle ejection direction perpendicular to extraction direction

Fig. 11. Stable spiral motion trajectory of ion between central and outer electrodes within Orbitrap mass analyzer^［56］

Fig. 12. Diagram of section of C-Trap ion accumulation device and Orbitrap mass analyzer^［56］

Fig. 13. Internal diagram of Cassinian ion trap^[58]

Fig. 14. Schematic diagram of fourth-order ion trap^[59]

Fig. 15. Microscope and laser device layout of LMS-GT^[65]

Fig. 16. Schematic of dual-pulse fs-laser system with miniature mass spectrometer^[67]

Fig. 17. Schematic of depth profiling and imaging of Cu-Sn-Pb alloy surface using LIMS^[68]

Fig. 18. Depth analysis curves of common contaminants in electrochemically deposited Cu samples obtained using SIMS^[70]

Fig. 19. Depth analysis curves of common contaminants in electrochemically deposited Cu samples containing multiple contaminated layers obtained using LIMS^[70]

Fig. 20. Signal intensity distributions of Sn, Ag and related organic pollutants C, O, and S at Sn-Ag solder joints obtained by two-dimensional layer-based method^[73]

Fig. 21. 3D element distributions recorded in Nantan meteorite^[8]. (a) Photograph of meteorite; (b)‒(s) distributions of specific elements in meteorite

Fig. 22. Ablation craters produced by laser ablation with different wavelengths^[75]. (a) Comparison of ablation craters; (b) close-up image of UV-258 nm ablation crater; (c) Gunflint chert sample view

Fig. 23. Elemental imaging of blue and white porcelain pieces of Ming Dynasty^[81]. (a) Imaging area of blue and white porcelain pieces of Ming Dynasty; (b)‒(p) images of multiple elements