Infrared Technology, Volume. 44, Issue 3, 225(2022)

Equivalent Modeling of PCB for Dynamic Properties Based on The Modal Test

Hexin TANG*, Wei ZHANG, Zhaoyang GUAN, Yu LIU, Xiaojun GUO, Fengwang LUO, Jiang LI, and Ying ZHANG
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    References(5)

    [3] [3] LEE Y C, WANG B T, LAI Y S, et al. Finite element model verification for packaged printed circuit board by experimental modal analysis[J]. Microelectronics Reliability, 2008, 48(11-12): 1837-1846.

    [5] [5] Pitarresi J M, Primavera A A. Comparison of modeling techniques for the vibration analysis of printed circuit cards[J]. Journal of Electronic Packing, 1992, 114(4): 378-383.

    [6] [6] WU J, ZHANG R R, Radons S. Vibration analysis of medical devices with a calibrated FEA model[J]. Computers & Structures, 2002, 80(12): 1081-1086.

    [9] [9] TANG W, REN J, FENG G, et al. Study on vibration analysis for printed circuit board of an electronic apparatus[C]//2007 International Conference on Mechatronics and Automation. IEEE, 2007: 855-860.

    [10] [10] Karthiheyan S, Verma V K, Saravanan S, et al. Dynamic response characteristics and fatigue life prediction of printed circuit boards for random vibration environments[J]. Journal of Failure Analysis and Prevention, 2020, 20(4): 920-929.

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    TANG Hexin, ZHANG Wei, GUAN Zhaoyang, LIU Yu, GUO Xiaojun, LUO Fengwang, LI Jiang, ZHANG Ying. Equivalent Modeling of PCB for Dynamic Properties Based on The Modal Test[J]. Infrared Technology, 2022, 44(3): 225

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    Paper Information

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    Received: Sep. 6, 2021

    Accepted: --

    Published Online: Apr. 22, 2022

    The Author Email: Hexin TANG (845477573@qq.com)

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