Chinese Journal of Liquid Crystals and Displays, Volume. 38, Issue 5, 582(2023)

Recent progress of wafer level Micro-LED chip inspection technology

Hao SU1, Wen-hao LI1, Jun-long LI1, Hui LIU2, Kun WANG1, Yong-ai ZHANG1,3, Xiong-tu ZHOU1,3, Chao-xing WU1,3、*, and Tai-liang GUO1,3、**
Author Affiliations
  • 1College of Physics and Information Engineering,Fuzhou University,Fuzhou 350108,China
  • 2College of Electronic Information Science,Fujian Jiangxia University,Fuzhou 350108,China
  • 3Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China,Fuzhou 350108,China
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    With the continuous progress in the manufacturing process of gallium nitride (GaN)?-based light-emitting diodes (LEDs), Micro-LED display is considered as an emerging display technology, which has broad prospects for near-eye display, large-scale displays device, flexible display, and other fields. The inspection of wafer-level Micro-LED chips can improve the yield of the screens and reduce the manufacturing cost of displayers, which is one of the key technologies related to Micro-LED display. For the inspection needs of large quantity (millions of orders) and small size (<50 μm) of wafer-level Micro-LED chip arrays, the existing electrical inspection technology has the disadvantages of low inspection efficiency and high cost. Therefore, Micro-LED chips inspection technology with improving inspection efficiency, improving inspection accuracy, and reducing inspection cost is the future development trend. In this paper, several indicators required for Micro-LED chip inspection are summarized. Then, the existing or proposed inspection methods are introduced and analyzed in detail. Finally, the future development of inspection technology is prospected.

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    Hao SU, Wen-hao LI, Jun-long LI, Hui LIU, Kun WANG, Yong-ai ZHANG, Xiong-tu ZHOU, Chao-xing WU, Tai-liang GUO. Recent progress of wafer level Micro-LED chip inspection technology[J]. Chinese Journal of Liquid Crystals and Displays, 2023, 38(5): 582

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    Paper Information

    Category: Research Articles

    Received: Nov. 24, 2022

    Accepted: --

    Published Online: Jul. 4, 2023

    The Author Email: Chao-xing WU (chaoxing_wu@fzu.edu.cn), Tai-liang GUO (gtl_fzu@hotmail.com)

    DOI:10.37188/CJLCD.2022-0392

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