Chinese Journal of Lasers, Volume. 36, Issue 4, 799(2009)
Design and Thermal Characteristics Analysis of Uncooled 980 nm Semiconductor Laser Packaging
[2] [2] Li Yi, Jiang Qunjie, Wu Bin et al.. Packaging technology of uncooled 980 nm pump laser modules [J]. Infrared and Laser Engineering, 2006, 35(Suppl.):110~114
[3] [3] Xingsheng Liu, Martin Hai Hu, Hong Ky Nguyen et al.. Comparison between epi-down and epi-up bonded high-power single-mode 980-nm semiconductor lasers [J]. IEEE Transactions on Advanced Packaging, 2004, 27(4):640~646
[7] [7] Takeshi Kobayashi, Yoshitake Furukawa. Temperature distributions in the GaAs-AlGaAs double-heterostructure laser below and above the threshold current [J]. Jpn. J. Appl. Phys., 1975, 14(12):1981~1986
[8] [8] K. Mizuishi. Some aspects of bonding-solder deterioration observed in long-lived semiconductor-lasers: solder migration and whisker growth [J]. J. Appl. Phys., 1984, 55(2):289~295
[9] [9] M. T. Sheen, C. M. Chang, H. C. Teng et al.. The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages [J]. J. Electron. Mater., 2002, 31(8):895~902
[10] [10] P. G. Kim, K. N. Tu. Morphology of wetting reaction of eutectic SnPb solder on Au foils [J]. Appl. Phys., 1996, 80(7):3822~3827
[11] [11] E. Zakel, H. Reichl. Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn [J]. IEEE Trans. Compon., Hybrids, Manuf. Technol., 1993, 16(3):323~332
[12] [12] Xingsheng Liu, Martin Hai Hu, Catherine G. Caneau et al.. Thermal management strategies for high power semiconductor pump lasers [C]. Proc. Int. Conf. Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, 2:493~500
Get Citation
Copy Citation Text
Wu Bin, Li Yi, Hu Shuangshuang, Jiang Qunjie, Wang Haifang. Design and Thermal Characteristics Analysis of Uncooled 980 nm Semiconductor Laser Packaging[J]. Chinese Journal of Lasers, 2009, 36(4): 799