Acta Optica Sinica, Volume. 42, Issue 13, 1305002(2022)
Fast Mask Optimization Method for Extreme Ultraviolet Lithography
Fig. 1. Schematic of EUV optics system and mask. (a) EUV optics system; (b) EUV mask
Fig. 2. Schematics of DEE optimization method. (a) Initial status; (b) optimization of edge pixels; (c) optimization of outer edge pixels; (d) status after optimization
Fig. 4. Difference between pattern edges and resist pattern contour at each position
Fig. 7. Simulation results of line-space pattern. (a) Aerial image; (b) calculation errors of pxSDM1 and pxSDM2
Fig. 10. Aerial images of two initial mask patterns obtained by different methods. (a)(e) RCWA; (b)(f) pxSDM1 without upsampling; (c)(g) pxSDM1 with upsampling; (d)(h) pxSDM2
Fig. 11. Comparisons of resist patterns and target patterns. (a)(c) Initial resist patterns; (b)(d) resist patterns after mask defocus
Fig. 12. Optimized masks and resist patterns of pattern 1. (a)(b) Optimization results of DEE method; (c)(d) optimization results of ADEE method
Fig. 13. Optimized masks and resist patterns of pattern 2. (a)(b) Optimization results of DEE method; (c)(d) optimization results of ADEE method
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Zinan Zhang, Sikun Li, Xiangzhao Wang, Wei Cheng. Fast Mask Optimization Method for Extreme Ultraviolet Lithography[J]. Acta Optica Sinica, 2022, 42(13): 1305002
Category: Diffraction and Gratings
Received: Dec. 23, 2021
Accepted: Jan. 10, 2022
Published Online: Jul. 15, 2022
The Author Email: Li Sikun (lisikun@siom.ac.cn), Wang Xiangzhao (wxz26267@siom.ac.cn)