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Microelectronics, Volume. 52, Issue 1, 115(2022)

COMSOL-Based Multi-Physical Field Coupling Characteristics for TSV Inductors

YIN Xiangkun1... LIU Jingting2 and WANG Fengjuan2 |Show fewer author(s)
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    YIN Xiangkun, LIU Jingting, WANG Fengjuan. COMSOL-Based Multi-Physical Field Coupling Characteristics for TSV Inductors[J]. Microelectronics, 2022, 52(1): 115

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    Received: Jun. 12, 2021

    Accepted: --

    Published Online: Jun. 14, 2022

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.210223

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology