Based on through-silicon via (TSV) technology, a spiral inductor for 3D integrated circuits was proposed. In the practical application, the electric field, temperature field and force field of the TSV inductor were coupled with each other, which would eventually degrade the actual electrical performance. Considering the effects of P- and N-type substrates, the effects of multi-physics coupling on TSV-based 3D spiral inductor were researched using COMSOL software. The results showed that the impact of multi-physical field coupling was much significant in P-type silicon substrate, and the variations of the inductance and quality factor reached as much as 14.13% and 5.91%, respectively.