Microelectronics, Volume. 51, Issue 2, 240(2021)
Optimization of Reinforced Component with Glue Process for Surface Mount Components
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LIAO Xiyi, DENG Li, GAO Zhenkui. Optimization of Reinforced Component with Glue Process for Surface Mount Components[J]. Microelectronics, 2021, 51(2): 240
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Received: Apr. 22, 2020
Accepted: --
Published Online: Mar. 11, 2022
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