Microelectronics, Volume. 51, Issue 2, 240(2021)

Optimization of Reinforced Component with Glue Process for Surface Mount Components

LIAO Xiyi, DENG Li, and GAO Zhenkui
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  • [in Chinese]
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    A method for improving the reinforcing quality of the surface mount components with glue was introduced. The key indexes to characterize the adhesive reinforcement process quality of surface mount elements were summarized. Based on the indexes, the orthogonal experiment was studied. According to the results, the reinforced component’s adhesive-force was improved and had high consistency. Moreover, some differences in the glue morphology and the influence of glue flowing on the nearby components were observed before and after improvement. The mechanism of reinforcing components with glue was discussed around the mainly factors.

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    LIAO Xiyi, DENG Li, GAO Zhenkui. Optimization of Reinforced Component with Glue Process for Surface Mount Components[J]. Microelectronics, 2021, 51(2): 240

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    Paper Information

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    Received: Apr. 22, 2020

    Accepted: --

    Published Online: Mar. 11, 2022

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.200174

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