Frontiers of Optoelectronics, Volume. 5, Issue 2, 119(2012)

Emerging trend for LED wafer level packaging

S. W. Ricky LEE1,2、*, Rong ZHANG1, K. CHEN1, and Jeffery C. C. LO1
Author Affiliations
  • 1Center for Advanced Microsystems Packaging, The Hong Kong University of Science & Technology (HKUST), Hong Kong, China
  • 2HKUST LED-FPD Technology R&D Center at Foshan, Guangdong 528200, China
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    S. W. Ricky LEE, Rong ZHANG, K. CHEN, Jeffery C. C. LO. Emerging trend for LED wafer level packaging[J]. Frontiers of Optoelectronics, 2012, 5(2): 119

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    Paper Information

    Received: Jan. 14, 2012

    Accepted: Feb. 8, 2012

    Published Online: Feb. 23, 2013

    The Author Email: S. W. Ricky LEE (leesw@fsldctr.org)

    DOI:10.1007/s12200-012-0259-9

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