Acta Physica Sinica, Volume. 69, Issue 17, 178703-1(2020)
Fig. 1. The timeline of the development of silk-based advanced materials for soft electronics: Bioresorbable electronics[3] (2009); ultraconformal bioelectronics[21](2010); flexible OTFTs[22] (2011); transient electronics[22](2012); conformal wireless biosensors[22](2012); flexible solar cells[31] (2014); bio-triboelectric generator[31] (2015); bio-memristor[33] (2015); carbonized silk fabric (CSF) wearable strain sensors[34] (2016); silk-derived carbon based E-skins[35] (2017); on-skin stretchable electrodes[36] (2018); biodegradable and stretchable protein-based sensor[37] (2019); all-textile electronic skin[38] (2019); electronic skin for human thermoregulation[39] (2020).
Fig. 2. Schema of the hierarchical network structures of SF fibers and none-fiber silk materials[46]. Lv1: the amino acid sequence; Lv2: α-helix & β-sheet; Lv3: β-crystallites; Lv4: crystal network; Lv5: nanofibrils network.
Fig. 3. Mesoscopic functionalization of silk-based materials: (a) The chemical bonding between SF and GO[47]; (b) the revisable structure changes of β-sheets and random coils under high thermal treatment[17]; (c) a silk-based memristor[33]; (d) silk nanofiber membrane for bio-triboelectric generator[32]; (e) schematic of β-sheet-derived carbon basic structural units[64].
Fig. 4. Design of silk-based strain sensor: (a) A graphite/silk flexible strain sensor with sheath-core structure[34]; (b) a wearable strain sensor based on carbonized silk fabric[65]; (c) an RSF-based hydrogel for monitoring human movement[67]; (d) an RSF-based single electrode TENG and strain sensor integrated platform[68].
Fig. 7. Design of silk-based temperature and humidity sensor: (a) A silk-derived wearable temperature and pressure sensor[74]; (b) a silk-based electronic fabric for temperature and pressure sensing[69]; (c) a self-healable multifunctional electronic tattoos based on RSF[75]; (d) an RSF-based heat-resistant electronic skin for thermoregulation[39].
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Sheng-You Li, Jia-Rong Liu, Hao Wen, Xiang-Yang Liu, Wen-Xi Guo.
Received: May. 31, 2020
Accepted: --
Published Online: Jan. 4, 2021
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