With the miniaturization and increasing frequency of pressure sensors, it has become critical to develop low-cost manufacturing processes. By studying the effect of different concentrations of TMAH on wafer corrosion, the optimal process conditions were determined to be 80 ℃ with 25 wt% TMAH, achieving a low roughness surface of 0.121 μm. Finite element simulations indicate that the sensitivity under 25 wt% wet etching conditions (103.276 mV/MPa) is closer to the design value of sensitivity (100 mV/MPa) than that under 5 wt% TMAH wet etching (109.162 mV/MPa). An efficient wet etching process is summarized, based on which a pressure sensor manufacturing process was designed. This approach is expected to produce sensors that more closely meet design requirements at a lower cost.