A finite element model of micro-scale laser shock peening (μLSP) was established utilizing ABAQUS.Process of μLSP of T2 pure copper was numerically simulated. The dynamic response of displacement, plastic strain, and equivalent stress as well as the distribution rule of residual stress during μLSP were analyzed. The results show that the dynamic yield limit of copper can be reached in a very short time after the shock wave acting at the surface. The diameter of the displacement-affected region at the surface of copper is about twice the laser spot diameter, and the maximum displacement of around 0.85 μm is achieved at 27 ns. With the increase of shock wave pressure, work hardening occurs in copper, and the maximum plastic strain and equivalent stress of about 0.062 and 297 MPa appear at the near-surface of the loaded region. The laser irradiated region of copper mainly shows residual compressive stress after μLSP which is about 199 MPa and has an influence depth of 40 μm. Residual tensile stress exists at the edge of laser irradiated region, indicating the appearance of “residual stress hole”. Meanwhile, the experimental results of μLSP are basically consistent with the numerical simulation results, which verify the reasonability and reliability of the finite element model.